Double-surface flexible copper-clad plate and manufacturing method thereof

A technology of flexible copper clad laminate and manufacturing method, which is applied in the directions of chemical instruments and methods, layered products, metal layered products, etc., can solve the problem that filler filling is not explained, and it is difficult to meet the requirements of good bendability of flexible copper clad laminates , The mechanical properties of the insulation substrate of the copper clad laminate are reduced, so as to improve the heat resistance, reduce the water absorption rate and cost, and reduce the coating amount.

Inactive Publication Date: 2011-04-13
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, fillers are rarely used in two-layer flexible copper clad laminates. The main consideration is that with the addition of fillers, the mechanical properties of the insulating base material of copper clad laminates will drop significantly, and it is difficult to meet the requirements of good bendability of flexible copper clad laminates. Require
For example, the patents of Nippon Steel Corporation, Zhongyuan Corporation and Xinyang Corporation did not elaborate on the problem of filler filling

Method used

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  • Double-surface flexible copper-clad plate and manufacturing method thereof
  • Double-surface flexible copper-clad plate and manufacturing method thereof
  • Double-surface flexible copper-clad plate and manufacturing method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0033] In the preparation process of flexible printed circuit boards, repeated water absorption and heating processes such as etching and hot pressing are likely to cause delamination of copper clad laminates. Therefore, improving the heat resistance of the substrate as much as possible and reducing the water absorption of the substrate as much as possible are issues of great concern to the circuit board industry. As we all know, the heat resistance of thermoplastic polyimide resin is much lower than that of thermosetting polyimide resin, so the heat resistance of the entire copper clad laminate depends on the heat resistance of thermoplastic polyimide resin, with the filler Adding, especially the addition of high heat-resistant fillers, the heat resistance of filler-filled thermoplastic polyimide resins is significantly improved compared with pure thermoplastic polyimide resins, so that the heat resistance of the entire copper clad laminate has a significant improvement. Ano...

Synthetic example 1

[0046] Add 440g of NMP (N-methylpyrrolidone) in a 500ml three-necked flask, add 18.16g of p-PDA, dissolve in the solution, cool the solution in a water bath, add 49.42g of BPDA under nitrogen flow, and then dissolve the solution Return to room temperature, continue to stir for 3 hours, and carry out polymerization reaction to prepare a viscous polyamic acid solution of thermosetting polyimide resin.

Synthetic example 2

[0048] Add NMP440g in a 500ml three-necked flask, add 30gSiO 2 , add 18.16g of p-PDA, dissolve in the solution, cool the solution in a water bath, add 49.42g of BPDA under nitrogen flow, then return the solution to room temperature, continue to stir for 3 hours, and carry out polymerization reaction to prepare viscous Thick polyamic acid solution of thermosetting polyimide resin. The amount of filler added to the polyamic acid solution accounts for 30% of the total solid weight.

[0049] Synthesis of Filler-Filled Thermoplastic Polyimide Resin

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Abstract

The invention relates to a double-surface flexible copper-clad plate and a manufacturing method thereof. The double-faced flexible copper-clad plate comprises two single-surface copper-clad plates which are arranged in a mirror symmetry way, each single-surface copper-clad plate comprises a copper foil, a thermosetting polyimide layer and a padding-filled thermoplastic polyimide layer, wherein the thermosetting polyimide layer and the padding-filled thermoplastic polyimide layer are sequentially coated on the copper foil; and the two single-surface copper-clad plates are mutually laminated and arranged in the mirror symmetry way along the padding-filled thermoplastic polyimide layer. With respect to the double-surface flexible copper-clad plate, the heat resistance of the copper-clad plates is enhanced and the water absorption rate and the cost of the copper-clad plates are reduced while the good flexibility resistance and bending resistance of the copper-clad plates are kept through the matching action of the thermoplastic polyimide layers with resins filled with padding and a thermosetting polyimide layer without being filled with the padding; and in addition, the double-surface flexible copper-clad plate has simple manufacturing process and is coated only twice so that the coating amount is greatly reduced, the production efficiency is enhanced, and the cost is reduced, and the double-surface flexible copper-clad plate is suitable for manufacturing flexible printed-circuit boards.

Description

technical field [0001] The invention relates to the field of copper clad laminates, in particular to a double-sided flexible copper clad laminate for flexible printed circuits and a manufacturing method thereof. Background technique [0002] Flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones, personal digital assistants and digital cameras. Due to the continuous improvement of technical requirements in the electronics industry, consumer electronics products are rapidly becoming thinner and smaller The corresponding flexible copper clad laminates are required to be lighter and thinner and have high heat resistance and high reliability. The two-layer flexible copper clad laminate has achieved rapid development in recent years due to the use of polyimide resin with excellent mechanical properties, electrical properties and heat resistance. [0003] As we all know, the polyimide resin used in the two-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B15/20B32B27/20B32B27/28
Inventor 张翔宇茹敬宏梁立伍宏奎
Owner GUANGDONG SHENGYI SCI TECH
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