Method for preparing epoxy moulding compound for packaging integrated circuit

A technology of epoxy molding compound and integrated circuit, which is applied in the direction of circuits, electrical components, and electrical solid devices. It can solve the problems of low uranium content, low thermal expansion coefficient, and high price in the synthesis of spherical silicon micropowder, and reduce the curing shrinkage rate. and thermal expansion coefficient, simple production process, and the effect of meeting performance requirements

Inactive Publication Date: 2011-04-13
吕高翔
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Crystalline silicon powder is characterized by high thermal conductivity and low price; molten silicon powder is characterized by low thermal expansion coefficient and high price, and synthetic spherical silicon powder has low uranium content but is expensive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Combining 84 parts of 600-mesh crystalline silica powder, 174 parts of 400-mesh fused silica micro-powder, and 70 parts of 2000-mesh fused silica micro-powder, a composite filler premix with a specific gravity of 60% to 70% is obtained. The curing agent is ball-milled with 1% nano-silica, then mixed with 61 parts of epoxy resin and 4.1 parts of flame retardant, and then added into the composite filler premix and mixed to obtain premix A. Mix 0.35 part of catalyst 1, 0.32 part of catalyst 2, 0.55 part of coloring agent, 1050 ml of coupling agent 1, 730 ml of coupling agent 2 and appropriate amount of release agent and toughening agent to obtain premix 2. Mix premix A and premix B, stir at high speed, melt extrude, tablet cool, pulverize, make cakes, pack, and freeze. When the produced epoxy molding compound is used for integrated circuit packaging, under the action of heat or accelerator, the epoxy resin and curing agent undergo a cross-linking and curing reaction, and b...

Embodiment 2

[0021] 148 parts of 200-mesh crystalline silicon powder, 140 parts of 400-mesh crystalline silicon powder, 35 parts of 600-mesh crystalline silicon powder, and 14.6 parts of 2000-mesh fused silicon powder are combined to obtain a composite filler premix with a specific gravity of 60% to 70%. The curing agent is ball-milled with 1% nano-silica, then mixed with 59 parts of epoxy resin and 4.2 parts of flame retardant, and then added into the composite filler premix and mixed to obtain premix A. Mix 0.325 parts of catalyst 1, 0.1 part of catalyst 2, 1.34 parts of coloring agent, 1500 ml of coupling agent, and appropriate amount of release agent and toughening agent to obtain premix B. Mix premix A and premix B, stir at high speed, melt extrude, tablet cool, pulverize, make cakes, pack, and freeze. When the produced epoxy molding compound is used for integrated circuit packaging, under the action of heat or accelerator, the epoxy resin and curing agent undergo a cross-linking and ...

Embodiment 3

[0023] 151 parts of 200-mesh crystalline silicon powder, 139 parts of 400-mesh crystalline silicon powder, 15 parts of 600-mesh crystalline silicon powder, 16.4 parts of 2000-mesh fused silicon powder, and 3 parts of spherical fused silicon powder are combined to obtain a specific gravity of 60% to 70%. Composite filler premix. The curing agent is ball-milled with 1% nano-silica, then mixed with 59 parts of epoxy resin and 4.2 parts of flame retardant, and then added into the composite filler premix and mixed to obtain premix A. 0.29 parts of catalyst 1, 0.29 parts of catalyst 2, 1.34 parts of coloring agent, 1050ml of coupling agent 1, 730ml of coupling agent 2 and an appropriate amount of release agent and toughening agent were mixed to obtain premix B. Mix premix A and premix B, add 1% monoglyceride, stir at a high speed, melt and extrude, tablet and cool, pulverize, make cakes, pack and store in freezer. When the produced epoxy molding compound is used for integrated circ...

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PUM

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Abstract

The invention discloses a method for preparing an epoxy moulding compound for packaging an integrated circuit, comprising the following specific steps of: firstly, mixng fused silica micro powder with crystallized silica micro powder in a certain ratio to obtain a compound filler premixer; secondly, ball milling a curing agent with a nano silicon dioxide, then mixing with epoxy resin and a flame retardant, adding the compound filler premixer and mixing to obtain a premixing material A; thirdly, mixing a catalyst, a coupling agent, a toughening agent and a mould release agent together to obtain a premixing material B; and finally, mixing the premixing material A with the premixing material B, stirring at a high speed, fusing and extruding, tabletting and cooling, crushing, forming cake, packaging, freezing and storing. The epoxy moulding compound prepared by the preparation method not only meets the performance requirement of an electronic package material, but also reduces the cost.

Description

Technical field: [0001] The invention relates to the preparation technology of epoxy molding compound for integrated circuit packaging, and the structural material obtained by using the preparation technology can be used for the subsequent packaging of (ultra) large-scale integrated circuits and microelectronic devices. Background technique: [0002] Molding compound has the advantages of light weight, low cost, simple molding process and good impact resistance. Its use has accounted for more than 95% of the entire packaging material, and epoxy molding compound is the most important one for packaging electronic devices and integrated circuits. Thermosetting polymer composite materials account for about 90% of plastic packaging. Epoxy molding compound is the basis for the development of microelectronics industry technology, and is the main structural material for (ultra) large-scale integrated circuits and microelectronic device back-end packaging. Its development level direc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/36H01L21/48H01L23/29
Inventor 吕建明
Owner 吕高翔
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