Single-layer capacitor and preparation method thereof

Abstract

The invention discloses a single-layer capacitor and a preparation method thereof. The preparation method comprises the preparation of ceramic slurry, the preparation of a ceramic green sheet, sintering, cleaning, the attachment of electrode layers to the upper and lower surfaces of a ceramic medium body, and cutting. In the sintering, the ceramic green sheet is arranged on a lower zirconia plate, and an upper zirconia plate is supported and covered above the lower zirconia plate by a gasket; the electrode layers are formed by vacuum sputtering; and laser cutting is adopted in the cutting. The single-layer capacitor prepared by the preparation method can meet design requirements, and has greatly improved yield of finished product, the length and width of 0.25 to 2.54 mm, the thickness of only 0.1 to 0.5 mm, ultra-small size, ultra-low equivalent series resistance, ultra-low equivalent series inductance, high Q value under radio frequency microwaves, and the application frequency of several GHz to dozens of GHz; therefore, the single-layer capacitor and the preparation method thereof are applied to hybrid microwave integrated circuits, monolithic microwave integrated circuits and the like.

Description

technical field [0001] The invention relates to chip electronic components, in particular to a single-layer capacitor and a preparation method thereof. Background technique [0002] In order to adapt to the development trend of miniaturization, integration and high frequency of electronic components, single-layer capacitors (SLC) are more and more favored by people. The structure of the single-layer capacitor includes a single-layer ceramic dielectric layer and an upper electrode layer and a lower electrode layer respectively located on two opposite surfaces of the ceramic dielectric layer. This structure makes the single-layer capacitor compared with the MLCC of the chip multi-layer structure, because the path of the current flowing through the former is much smaller than the latter during operation, so it has much smaller equivalent series resistance and equivalent series resistance than the MLCC under radio frequency and microwave. series inductor, resulting in a higher ...

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Problems solved by technology

[0003] However, the thickness of single-layer ceramic capacitors is thin, and the existing sintering process is prone to deformation problems, which affects the flatness and performance of the finished product; The thin thickness is not conducive to the miniaturization of single-layer ceramic capacitors, and the electrode material consumption is large; the chip is easily broken by the general mechanical cutting method, and the yield is low

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