High-heat-conduction flexible aluminum base copper-clad plate for LED heat radiating substrate

An aluminum-based copper-clad laminate, high thermal conductivity technology, applied in the direction of semiconductor devices, carboxyl rubber adhesives, non-polymer adhesive additives, etc., can solve the problem of no flexibility, no test data, and no description in the performance test phase Substrate and other issues

Inactive Publication Date: 2011-04-20
HAISO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese patent CN101287335A uses an electrochemical method to form an oxide insulating layer with a high thermal conductivity circuit substrate, and the oxide insulating layer is gen...

Method used

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  • High-heat-conduction flexible aluminum base copper-clad plate for LED heat radiating substrate
  • High-heat-conduction flexible aluminum base copper-clad plate for LED heat radiating substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Add the proportioned amount of epoxy resin, dissolved nitrile rubber, ground inorganic filler, low molecular polyamide curing agent and organic solvent into a 10L container, and stir at room temperature for 3 to 5 hours to form a uniform After the mixed solution is filtered through a 300-mesh filter to remove a small amount of impurities, it is formulated into a high thermal conductivity epoxy resin glue.

[0041] Use the coating machine to coat the adhesive on both sides of the 50 μm polyimide film twice, and form a dry glue of 10 μm on one side after baking in the oven, and then use the compound machine to coat the polyimide film that has been coated with glue. Copper foil and aluminum foil are laminated on both sides of the composite machine respectively, and the temperature of the continuous roll forming of the composite machine is 50±2°C, the line pressure is 2MPa, and the line speed of the roll is 0.5 m / min. Then put it into an oven for post-curing, after stepwise...

Embodiment 2

[0043] The formula of the high thermal conductivity epoxy resin glue is shown in Example 2 in Table 1, and the preparation process of the epoxy resin glue is as described in Example 1.

[0044] Use the coating machine to coat the adhesive on both sides of the 35 μm polyimide film twice, and form a dry glue of 15 μm on one side after baking in the oven, and then pass the compound machine on the polyimide film that has been coated with glue. Copper foil and aluminum foil are laminated on both sides of the composite machine respectively. The temperature of the continuous roll forming of the composite machine is 60±2°C, the line pressure is 2MPa, and the line speed of the roll is 1 m / min. Then put it into an oven for post-curing. After stepwise heating, keep the temperature at 140±2°C and keep the curing time for 70 minutes to prepare a high thermal conductivity flexible aluminum-based copper-clad laminate. The performance test is shown in Table 2.

Embodiment 3

[0046] The formula of the high thermal conductivity epoxy resin glue is shown in Example 3 in Table 1, and the preparation process of the epoxy resin glue is as described in Example 1.

[0047] Use the coating machine to coat the adhesive on both sides of the 25μm polyimide film twice, and form a dry glue of 25μm on one side after baking in the oven, and then use the compound machine to coat the polyimide film that has been coated with glue. Copper foil and aluminum foil are laminated on both sides of the composite machine respectively. The temperature of the continuous roll forming of the composite machine is 65±2°C, the line pressure is 3MPa, and the line speed of the roll is 3 m / min. Then put it into an oven for post-curing. After stepwise heating, keep the temperature at 145±2°C and keep the curing time for 75 minutes to prepare a highly thermally conductive flexible aluminum-based copper-clad laminate. The performance test is shown in Table 2.

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Abstract

The invention provides a production method of a high-heat-conduction flexible aluminum base copper-clad plate for an LED heat radiating substrate. The method mainly comprises the following step of preparing a high-heat-conduction epoxy adhesive. In the method, the high-heat-conduction epoxy adhesive is coated at two sides of a polyimide membrane, wherein a copper foil is bonded at one side, an aluminum foil is bonded at the other side, and then a high-heat-conduction flexible aluminum base copper-clad plate which can be used for an LED heat radiating substrate is prepared through continuous hot-pressing molding and high-temperature post-curing treatment. The substrate has the advantages of ultrathin thickness, high temperature resistance, flexibility, high heat condition, good insulating property, high peel strength, and the like.

Description

technical field [0001] The invention relates to a high thermal conductivity epoxy adhesive and its preparation and application. The present invention is mainly applied to high thermal conductivity flexible aluminum-based copper clad laminates for LED heat dissipation substrates, and its greatest advantages are high thermal conductivity and high flexibility. It belongs to the application field of polymer composite materials. technical background [0002] LED (Light-Emitting-Diode) is a semiconductor component that can convert electrical energy into visible light. Its downstream applications are mainly in the fields of flat panel display, mobile phone display, lighting, infrared LED and OLED. [0003] The rapid expansion of the LED industry and its market at home and abroad has provided a good opportunity for the development of the LED raw material industry. Raw materials for LEDs are an important basis for the development of LEDs. Especially with the improvement of LED lumi...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J113/00C09J177/00C09J11/04H01L33/48H01L33/64B32B15/08
Inventor 范和平李桢林
Owner HAISO TECH
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