Film material for high-sensitivity metal Hall sensor and preparation method of film material
A technology of Hall sensor and thin film material, which is applied in the field of metal magnetic field sensor thin film material and its preparation, can solve the problem of weak Hall signal, etc., and achieve the effects of improved magnetic field sensitivity, simple preparation process, and obvious magnetic field sensitivity
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Embodiment 1
[0021] The magnetic film was prepared in a magnetron sputtering apparatus. First, the monocrystalline silicon substrate was cleaned ultrasonically with organic chemical solvents and deionized water, and then mounted on the sample base of the vacuum sputtering chamber. The substrate is cooled by circulating water. Background vacuum during sputtering 1×10 -5 Pa, deposited sequentially under the condition of argon (purity 99.99%) pressure 0.2Pa as well as The film is produced. Then, the thin film material is processed into a Hall resistance bar element with a line width of 30 microns through general semiconductor processing technology; general semiconductor processing technology refers to: glue rejection, exposure, development, film hardening, etching, etc.
[0022] figure 1 It is a schematic diagram of the structure of the Hall resistance bar. figure 2 It is the Hall signal output curve of the film material measured by the standard four-probe method. The magnetic field sensit...
Embodiment 2
[0024] The magnetic film was prepared in a magnetron sputtering apparatus. First, the monocrystalline silicon substrate was cleaned ultrasonically with organic chemical solvents and deionized water, and then mounted on the sample base of the vacuum sputtering chamber. The substrate is cooled by circulating water. Background vacuum during sputtering 1×10 -5 Pa, under the condition of argon (purity 99.99%) pressure of 0.2Pa, the deposition structure is (t respectively take 5, ) Series of films. Then, the thin film material is processed into a Hall resistance bar element with a line width of 30 microns through a general semiconductor processing technology; the general semiconductor processing technology refers to: glue rejection, exposure, development, film hardening, etching, etc.
[0025] image 3 The series of thin film materials with the above structure are designed and processed into the Hall signal output curve of the Hall resistance bar element; it can be seen that by opti...
Embodiment 3
[0027] The magnetic film was prepared in a magnetron sputtering apparatus. First, the monocrystalline silicon substrate was cleaned ultrasonically with organic chemical solvents and deionized water, and then mounted on the sample base of the vacuum sputtering chamber. The substrate is cooled by circulating water. Background vacuum during sputtering 1×10 -5 Pa, under the condition of argon (purity 99.99%) pressure of 0.2Pa, the deposition structure is (n takes 2-10) and the structure is (n takes 2-10) series of films. Then, the thin film material is processed into a Hall resistance bar element with a line width of 30 microns through general semiconductor processing technology; general semiconductor processing technology refers to: glue rejection, exposure, development, film hardening, etching, etc.
[0028] Figure 4 The series of thin film materials with the above structure are designed and processed into a curve of the magnetic field sensitivity of the Hall resistance bar e...
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