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High-strength high-conductivity micro-boron copper alloy material and preparation method thereof

A high-conductivity, high-strength technology, applied in the fields of high-strength and high-conductivity copper alloy materials and preparation, high-strength and high-conductivity micro-boron copper alloy materials and preparation fields, can solve problems that go against sustainable development strategies and are difficult to recycle. Use, increase production costs and other issues, to achieve good industrial application prospects, easy recycling, and low production costs

Inactive Publication Date: 2011-05-04
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although its performance basically meets the requirements, a large amount of precious rare earth elements are added to it, which greatly increases its production cost, and it is not easy to recycle and reuse, which is contrary to the sustainable development strategy

Method used

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  • High-strength high-conductivity micro-boron copper alloy material and preparation method thereof

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Embodiment Construction

[0024] The present invention will be described in further detail below in conjunction with specific embodiments.

[0025] The present invention provides 8 embodiments, and the alloy components are respectively:

[0026] 1. Cu0.07B0.5Zr,

[0027] 2. Cu0.14B0.9Zr,

[0028] 3. Cu0.02B0.2Zr,

[0029] 4. Cu0.12B0.5Te,

[0030] 5. Cu0.06B0.5Te,

[0031] 6. Cu0.04B0.5Zr0.6Te

[0032] 7. Cu0.2B0.5Zr0.6Te

[0033] 8. Cu0.01B0.9Zr0.9Te

[0034] Adopt the following process method to prepare and process;

[0035] Step 1: Smelting

[0036] According to the distribution ratio of each component of the alloy, boron, rare metals and copper are weighed respectively, and melted in vacuum or in the atmosphere. The melting temperature is 1200±50°C, and the iron mold is cast into an ingot;

[0037] The second step: hot rolling after a solid solution

[0038] Heat the alloy after the first step of smelting to 900-1000°C, keep it warm for 0.5-1.5h, quench it in water, perform a solid soluti...

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Abstract

The invention relates to a high-strength high-conductivity micro-boron copper alloy material which comprises the following components in percentage by weight: 0.01-0.2% of B, 0.2-1.8% of rare metal (the rare metal is one or two of Zr and Te), balance of Cu and unavoidable impurities. The preparation method comprises the following steps: smelting, and ausforming to obtain the copper-based alloy having fine performance. The obtained alloy has superior comprehensive performance, wherein the tensile strength is 530-600 MPa, the conductivity is 78-95%IACS (International Annealing Copper Standard), and the extensibility is no less than 12%; and the alloy has the advantages of low cost, simple preparation process and the like, and is easy to recycle and process. The copper alloy material provided by the invention is mainly applicable to the fields of lead wires of a high-speed electrified railway contact network, lead frames of large-scale integrated circuits, electrode materials and the like, and has fine industrial application prospects.

Description

technical field [0001] The invention relates to a high-strength and high-conductivity copper alloy material and a preparation method, in particular to a high-strength and high-conductivity micro-boron-copper alloy material and a preparation method; it belongs to the technical field of non-ferrous metal materials. Background technique [0002] Copper and its alloys have been widely used in electric power, machinery, electronics, transportation and energy industries due to their good electrical conductivity, thermal conductivity, fatigue resistance, chemical stability, strength and ease of manufacture, and have become important Electronic metal materials. With the rapid development of economy and science and technology, higher requirements are put forward for the performance of high-strength and high-conductivity copper alloys used in the fields of high-speed electrified railway catenary wires, large-scale integrated circuit lead frames, and electrode materials. However, due ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22F1/08
Inventor 杨续跃马继军张之岭
Owner CENT SOUTH UNIV
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