Epoxy resin glue for photoelectron attenuation-resistant packaging

An epoxy resin glue, epoxy resin technology, applied in circuits, electrical components, semiconductor devices and other directions, can solve the problems of reducing the reliability of high-power LEDs, easy to crack, easy to turn yellow, etc., to achieve excellent anti-aging characteristics, on-site Easy to formulate, excellent anti-decay effect

Inactive Publication Date: 2011-05-25
东莞市永固绝缘材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional epoxy resin encapsulation materials tend to turn yellow under the action of short-wave radiation and high temperature, and have defects such as brittle texture, l...

Method used

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  • Epoxy resin glue for photoelectron attenuation-resistant packaging
  • Epoxy resin glue for photoelectron attenuation-resistant packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Glue A (resin part), 10 parts of hydrogenated bisphenol A epoxy resin, 20 parts of alicyclic epoxy resin, 70 parts of bisphenol A type epoxy resin, 0.2 part of light stabilizer, 0.1 part of antioxidant and defoamer 0.1 copies;

[0033] B glue (curing agent part), 100 parts of methyl hexahydrophthalic anhydride, 1 part of organic phosphine compound and 2.5 parts of quaternary ammonium salt.

Embodiment 2

[0035] Glue A (resin part), 70 parts of hydrogenated bisphenol A epoxy resin, 30 parts of cycloaliphatic epoxy resin, 1.2 parts of light stabilizer, 1.5 parts of antioxidant and 2 parts of defoamer;

[0036] B glue (curing agent part), 40 parts of methyl hexahydrophthalic anhydride, 60 parts of hexahydrophthalic anhydride, 5 parts of organic phosphine compound.

Embodiment 3

[0038] Glue A (resin part), 40 parts of hydrogenated bisphenol A epoxy resin, 40 parts of alicyclic epoxy resin, 20 parts of bisphenol A type epoxy resin, 1.2 parts of light stabilizer, 1.5 parts of antioxidant and defoamer 2 copies;

[0039] B glue (cured part), 60 parts of methyl hexahydrophthalic anhydride, 40 parts of hexahydrophthalic anhydride, 2 parts of organic phosphine compound and 3 parts of cyclic amidine complex.

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PUM

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Abstract

The invention relates to epoxy resin glue for photoelectron attenuation resistant packaging. The epoxy resin glue consists of glue A and glue B, wherein the glue A is a resin part mixed in parts by weight, and the glue B is a curing agent part mixed in parts by weight; the glue A consists of 10-70 parts of hydrobisphenol A epoxy resin, 20-60 parts of cycloaliphatic epoxide, 0-80 parts of bisphenol A epoxy resin, 0.02-2 parts of light stabilizer, 0.02-2 parts of antioxidant and 0,01-2 parts of defoamer; and the glue B consists of 40-100 parts of methyl hexahydrophthalicanhydride, 0-60 parts of hexahydrophthalic anhydride, 1-5 parts of organphosphorus compound, 0-4 parts of quaternary phosphonium salt complex and 0-3 parts of antioxidant. The epoxy resin glue prepared by using the glue A and the glue B on the spot has the characteristics of good attenuation resistance and aging resistance, namely, the existing product is yellowed after being aged for 20 hours at the temperature of 150 DEG C, but the product obtained by the invention has no obvious variation after being aged for 100 hours at the temperature of 150 DEG C, and the high-temperature luminous attenuation of the product obtained by the invention is far smaller than that of similar products within 2000 hours.

Description

Technical field [0001] The present invention involves an epoxy resin glue for an optoelectronics anti -decay packaging, especially the anti -aging epoxy resin glue for an anti -aging anti -aging epoxy resin glue for LED packaging. Background technique [0002] Lighting diode (LED) is a solid light source. Because of its environmental protection, energy saving, and long service life, it has become a traditional lighting equipment.Due to the characteristics of high transparency, good mechanicality, good mechanicality, corrosion resistance, excellent electrical performance, and low cost, it is widely used as an LED packaging material.With the development of LEDs, LEDs can emit a shorter wavelength light.Traditional epoxy resin encapsulation materials are easily yellow under short -wave radiation and high temperature, and their existence of defects such as crispy texture, low impact strength, and easy cracking. These defects reduce the reliability of high -power LEDs, and it is diffi...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08G59/40C08G59/42H01L33/56
Inventor 刘屹汝宗林
Owner 东莞市永固绝缘材料有限公司
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