Method for preparing multi-level structural microarray by laser direct-writing technology

A technology of laser direct writing and microarray, applied in optomechanical equipment, microlithography exposure equipment, optics, etc. Focus problem, the effect of fast processing speed

Inactive Publication Date: 2011-06-15
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1
View PDF6 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The level of domestic laser direct writing production technology is far from meeting the requirements of wide practical application

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing multi-level structural microarray by laser direct-writing technology
  • Method for preparing multi-level structural microarray by laser direct-writing technology
  • Method for preparing multi-level structural microarray by laser direct-writing technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] according to Figure 6 The method shown, "top-down" to prepare the specific implementation steps of the secondary structure (first-level structure size: diameter 200 μm, spacing 500 μm, height 120 μm; second-level structure size: diameter 20 μm, spacing 40 μm, height 40 μm) For: 1. Hot roll coating. Using 650RS coil laminating machine, the temperature is 110°C, and the laminating speed is 1m / min. The film is rolled and laminated on the substrate. The single-layer film thickness is 40μm and can be laminated multiple times as needed. This implementation is one layer of lamination. 2. Fully exposed, as a soft base. Fully expose the laminated film to ultraviolet light for 5 minutes. At this time, the color of the photoresist changes from light blue to dark blue, forming a soft base. 3. Second coat. The film is pasted on the soft substrate by hot rolling, and can be laminated multiple times as required. In this case, 4 layers of film are implemented. 4. Expose piece by p...

Embodiment 2

[0036] according to Figure 6 The method shown, "top-down" to prepare the specific implementation steps of the secondary structure (first-level structure size: diameter 200 μm, spacing 500 μm, height 152 μm; second-level structure size: diameter 3 μm, spacing 8 μm, height 8 μm) For: 1. Hot roll coating. Using 650RS coil laminating machine, the temperature is 110°C, and the laminating speed is 1m / min. The film is rolled and laminated on the substrate. The single-layer film thickness is 40μm and can be laminated multiple times as needed. This implementation is one layer of lamination. 2. Fully exposed, as a soft base. Fully expose the laminated film to ultraviolet light for 5 minutes. At this time, the color of the photoresist changes from light blue to dark blue, forming a soft base. 3. Second coat. The film is pasted on the soft substrate by hot rolling, and can be laminated multiple times as required. In this case, 4 layers of film are implemented. 4. Expose piece by piec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
elastic modulusaaaaaaaaaa
diameteraaaaaaaaaa
heightaaaaaaaaaa
Login to view more

Abstract

The invention discloses a method for preparing a multi-level structural microarray by a laser direct-writing technology, and belongs to the field of laser micromachining. In an array preparation process, a plane geometry structure is determined by plane figures input into a computer; the resolution depends on the multiple of a microfilm lens in a light path and the precision of a nanomotor and can reach 0.3 mu m; and based on the relationship between exposure depth and exposure time and the relationship between development depth and development time obtained by an experiment, the depth of a machining size is controlled by the regulation and the control of the exposure time and the development time. The method does not need a mask or a photolithography model, greatly reduces the preparation cost of arrays, has the feasibility of preparing a multi-level structure and high efficiency, and is suitable for the popularization of industrial production.

Description

Technical field: [0001] The invention relates to a method for preparing a multilevel structure microarray by laser direct writing technology, belonging to the field of laser micromachining. Background technique: [0002] The excellent climbing ability of the gecko depends on the Van der Waals force generated by the contact between the millions of micron-scale bristles and nano-scale hairy arrays on the soles of its feet. With the help of gecko feet, the imitation gecko robot can move without obstacles in three-dimensional space, and has a broad application space in the fields of aerospace, anti-terrorism and daily life. Therefore, it is of great significance to prepare gecko-like setae micro-nano arrays. [0003] At present, the methods related to photolithography to prepare micro-nano secondary structure arrays include thick resist direct lithography (attached figure 1 ) (J. Micromech. Microeng. 17 (2007) R81–R95) and photolithographic modeling (casting and curing o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/00G03F7/30G03F7/20
Inventor 于敏浦东林耿路峰陈林森戴振东
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap