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Method for preparing multi-level structural microarray by laser direct-writing technology

A technology of laser direct writing and microarray, applied in optomechanical equipment, microlithography exposure equipment, optics, etc. Focus problem, the effect of fast processing speed

Inactive Publication Date: 2011-06-15
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The level of domestic laser direct writing production technology is far from meeting the requirements of wide practical application

Method used

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  • Method for preparing multi-level structural microarray by laser direct-writing technology
  • Method for preparing multi-level structural microarray by laser direct-writing technology
  • Method for preparing multi-level structural microarray by laser direct-writing technology

Examples

Experimental program
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Effect test

Embodiment 1

[0034] according to Figure 6 The method shown, "top-down" to prepare the specific implementation steps of the secondary structure (first-level structure size: diameter 200 μm, spacing 500 μm, height 120 μm; second-level structure size: diameter 20 μm, spacing 40 μm, height 40 μm) For: 1. Hot roll coating. Using 650RS coil laminating machine, the temperature is 110°C, and the laminating speed is 1m / min. The film is rolled and laminated on the substrate. The single-layer film thickness is 40μm and can be laminated multiple times as needed. This implementation is one layer of lamination. 2. Fully exposed, as a soft base. Fully expose the laminated film to ultraviolet light for 5 minutes. At this time, the color of the photoresist changes from light blue to dark blue, forming a soft base. 3. Second coat. The film is pasted on the soft substrate by hot rolling, and can be laminated multiple times as required. In this case, 4 layers of film are implemented. 4. Expose piece by p...

Embodiment 2

[0036] according to Figure 6 The method shown, "top-down" to prepare the specific implementation steps of the secondary structure (first-level structure size: diameter 200 μm, spacing 500 μm, height 152 μm; second-level structure size: diameter 3 μm, spacing 8 μm, height 8 μm) For: 1. Hot roll coating. Using 650RS coil laminating machine, the temperature is 110°C, and the laminating speed is 1m / min. The film is rolled and laminated on the substrate. The single-layer film thickness is 40μm and can be laminated multiple times as needed. This implementation is one layer of lamination. 2. Fully exposed, as a soft base. Fully expose the laminated film to ultraviolet light for 5 minutes. At this time, the color of the photoresist changes from light blue to dark blue, forming a soft base. 3. Second coat. The film is pasted on the soft substrate by hot rolling, and can be laminated multiple times as required. In this case, 4 layers of film are implemented. 4. Expose piece by piec...

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Abstract

The invention discloses a method for preparing a multi-level structural microarray by a laser direct-writing technology, and belongs to the field of laser micromachining. In an array preparation process, a plane geometry structure is determined by plane figures input into a computer; the resolution depends on the multiple of a microfilm lens in a light path and the precision of a nanomotor and can reach 0.3 mu m; and based on the relationship between exposure depth and exposure time and the relationship between development depth and development time obtained by an experiment, the depth of a machining size is controlled by the regulation and the control of the exposure time and the development time. The method does not need a mask or a photolithography model, greatly reduces the preparation cost of arrays, has the feasibility of preparing a multi-level structure and high efficiency, and is suitable for the popularization of industrial production.

Description

Technical field: [0001] The invention relates to a method for preparing a multilevel structure microarray by laser direct writing technology, belonging to the field of laser micromachining. Background technique: [0002] The excellent climbing ability of the gecko depends on the Van der Waals force generated by the contact between the millions of micron-scale bristles and nano-scale hairy arrays on the soles of its feet. With the help of gecko feet, the imitation gecko robot can move without obstacles in three-dimensional space, and has a broad application space in the fields of aerospace, anti-terrorism and daily life. Therefore, it is of great significance to prepare gecko-like setae micro-nano arrays. [0003] At present, the methods related to photolithography to prepare micro-nano secondary structure arrays include thick resist direct lithography (attached figure 1 ) (J. Micromech. Microeng. 17 (2007) R81–R95) and photolithographic modeling (casting and curing o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/00G03F7/30G03F7/20
Inventor 于敏浦东林耿路峰陈林森戴振东
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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