Cu-co-si copper alloy for use in electronics, and manufacturing method therefor

Abstract

Provided is a Cu-Co-Si alloy that has mechanical and electrical properties suitable for a copper alloy for use in electronics, and has uniform mechanical properties. Said copper alloy contains 0.5-4.0% cobalt and 0.1-1.2% silicon by mass, with the remainder comprising copper and unavoidable impurities. The mean grain size is 15-30 micrometers, and the difference in diameter between the smallest and largest grains in each 0.5 mm2 area is, on average, no more than 10 micrometers.

Description

Cu-Co-Si system copper alloy for electronic material and manufacturing method thereof technical field The present invention relates to a precipitation-hardening copper alloy, in particular to a Cu-Co-Si-based copper alloy suitable for use in various electronic device components. Background technique Copper alloys for electronic materials used in various electronic device components such as connectors, switches, relays, pins, terminals, and lead frames are required to have both high strength and high electrical conductivity (or thermal conductivity) as basic characteristics. In recent years, the high integration, miniaturization, and thinning of electronic components have rapidly progressed, and correspondingly, the level of requirements for copper alloys used in electronic device components has also gradually increased. From the standpoint of high strength and high conductivity, as copper alloys for electronic materials, the use of precipitation-hardened copper alloys is ...

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Problems solved by technology

According to Patent Document 3, the reason why the Co concentration is set within the above range is that if the amount of Co added is less than 0.5% by mass, the required strength cannot be obtained, and if the amount of Co exceeds 2.5% by mass, although high strength can be achieved, the electrical conductivity Remarkably lower, and the hot workability deteriorates, Co is preferably 0.5 to 2.0% by mass

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