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Adhesive composition

A composition and adhesive technology, applied in the direction of adhesives, non-polymer organic compound adhesives, etc., can solve the problems of difficult resin design, inability to use water, poor environment, etc., and achieve the effect of excellent adhesion

Inactive Publication Date: 2011-07-13
AICA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Each of these resins has the following characteristics: hot-melt resins are strong against water solvents, but the difficulty is that they must be processed at a high melting temperature exceeding the processing temperature, and the resin cannot be completely removed.
Water-soluble resins are water-soluble and easy to use, but cannot handle water
Solvent soluble resins are not environmentally friendly due to the use of solvents
In the case of alkaline aqueous soluble and acid soluble resins, it is difficult to design the resin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Firstly, 90 parts by weight of "jER828" (Japan Epoxy Resins (Co., Ltd.); trade name; epoxy equivalent 184-194; specific gravity 1.17; molecular weight about 370) and reactive diluent "YED216" (Japan Epoxy Resins ( Co., Ltd.); trade name; epoxy equivalent 145-165; alkyl diglycidyl ether (alkyl diglycidyl ether)) 8 parts by weight, silane coupling agent "KBM-403" (Shin-Etsu Chemical Co., Ltd.; trade name ; chemical name γ-(2,3-glycidoxy) propyltrimethoxysilane (3-glycidoxypropyltrimethoxysilane)) 2 parts by weight, and " Ecorandom (registered trademark) 1200 " (Asahi Glass (shares) Co., Ltd.); trade name; D50 is 7 to 8 μm) 100 parts by weight, and stirred for 1 hour using a mixer to uniformly mix. Secondly, "RC11" (Japan Epoxy Resins (Co., Ltd.); trade name; modified aliphatic polyamines); amine value (amine value) (from KOHmg / g to 345 to 385)) 60 parts by weight and then further stirred for 5 minutes, that is, the adhesive composition of Example 1 was produced.

Embodiment 2

[0045] Except that "Ecorandom 1200" of Example 1 was replaced with "Cellmic (registered trademark) B-819" (Sankyo Chemical Co., Ltd.; trade name; D50 is 10 μm), the same procedure was carried out as in Example 1, namely The adhesive composition of Example 2 was manufactured.

Embodiment 3

[0047] Except that "Ecorandom 1200" in Example 1 was replaced with "Cellmic 266" (Sankyo Chemical Co., Ltd.; trade name; D50 is 20 μm), the same procedure as in Example 1 was carried out, that is, the product of Example 3 was produced. Adhesive composition.

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Abstract

The invention provides an adhesive composition capable of being stripped via water in a state of comprising adhesive performance. The solution is that the adhesive composition is formed in a mode of comprising resin used for nonaqueous solvent-free adhesion and sodium bicarbonate powder, preferably, the adhesive composition is formed in a mode of comprising resin used for nonaqueous solvent-free adhesion and sodium bicarbonate powder, and cellulose derivative powder. The resin used for nonaqueous solvent-free adhesion is preferably a thermosetting epoxy resin.

Description

technical field [0001] The present invention relates to an adhesive composition used for cutting, cutting, grinding, etc., and temporarily fixing a workpiece to a base. Background technique [0002] Temporary fixing adhesives conventionally used during processing include hot-melt resins, water-soluble resins, solvent-soluble resins, alkaline aqueous solution-soluble resins, acid-soluble resins, and the like. Each of these resins has the following characteristics: hot-melt resins are strong against water solvents, but they have difficulties in that they must be handled at a high melting temperature exceeding the high temperature during processing, and the resins cannot be completely removed. Water-soluble resins are water-soluble and easy to use, but water cannot be used for disposal. Solvent-soluble resins are not environmentally friendly because they use solvents. As far as alkaline aqueous solution-soluble and acid-soluble resins are concerned, it is difficult to design ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02
Inventor 小石宣敬
Owner AICA KOGYO CO LTD
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