Method for processing wireless gold-plating printed plate

Abstract

The invention discloses a method for processing a wireless gold-plating printed plate, which comprises the following steps of: removing goldclad wires from the printed plate through gold-plating and pertinency gold-removing manners, putting the printed board in a gold-removing solution at the temperature of 25+ / -5 DEG C and removing gold from the wire of the printed board to expose coppers, wherein gold-removing solution contains 90+ / - 10g / L iodine and 200+ / -20 g / L potassium iodide. According to the method, the gold on the goldclad wires is removed by using gold-removing liquid medicines so that the copper is exposed; the goldclad wire is etched and removed, so that advantages of no pollution to a gold cylinder and realization of mass processing are combined, and the color of the gold face is easy to control. That the method has the advantages of no pollution to the gold cylinder and realization of easy control of the colour of the gold face because the copper-naked printed board is plated with gold and no wet film is dissolved to cause pollution.

Description

technical field [0001] The invention removes the electroplated wires of the thick gold printed board. The technology belongs to the field of printed circuit board manufacturing. Background technique [0002] The high frequency of electronic equipment is a development trend, especially with the increasing development of wireless networks and satellite communications, information products are moving towards high speed and high frequency, and communication products are moving towards large-capacity and fast-speed wireless transmission of voice, video and data standardization. Therefore, more and more printed boards adopt the design of high-frequency substrates and thick gold plating. At present, the processing method of gold-plated printed boards is generally gold-plated by wire method, and finally there are two ways to remove these gold-plated wires: 1. , Use a blade to remove manually. 2. Before gold-plating, cover the gold-plated wire with a wet film. During gold-plating, ...

AI Technical Summary

Problems solved by technology

However, these two methods have disadvantages: the first method of removing the wires of the gold-plated printed board, it is difficult to manually control the position and strength of removing the wires, and the workload is cumbersome, the wires are easy to be cut uncleanly, and the remaining wires after removal The length is different, it is easy to damage the substrate, and the efficiency is low and cannot be processed in batches; the second method to remove the gold-plated printed board wire, the method of removing the gold-plated printed board wire, with the increase of the thickness of the gold plating, the wet film has poor electroplating resistance, Easy to permeate plating; the gold plating time is prolonged, the wet film dissolves in the gold plating solution, pollutes the gold cylinder, and makes it difficult to control the gold color during the gold plating process

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