Manufacture method for negative type photosensitive resin composition and cured relief pattern

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, and can solve problems such as wiring resistance that cannot be ignored

Active Publication Date: 2011-08-24
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Furthermore, due to advancement in the miniaturization of semiconductor devices, the wiring resistance of semiconductor devices has become unnegligible.

Method used

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  • Manufacture method for negative type photosensitive resin composition and cured relief pattern
  • Manufacture method for negative type photosensitive resin composition and cured relief pattern
  • Manufacture method for negative type photosensitive resin composition and cured relief pattern

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0071] (A) The preparation method of polyimide precursor

[0072] In (A) the polyimide precursor, the structure represented by the above-mentioned general formula (1) can be obtained as follows, for example: first, make the compound containing the aforementioned 4-valent organic group X 1 Tetracarboxylic dianhydrides react with photopolymerizable alcohols with unsaturated double bonds and any saturated aliphatic alcohols with 1 to 4 carbons to obtain partially esterified tetracarboxylic acids (hereinafter also referred to as acid -ester body), then, make it with the aforementioned 2-valent organic group Y 1 amide polycondensation of diamines.

[0073] Preparation of acid-ester body

[0074] In the present invention, as a polyimide precursor that can be suitably used to prepare (A) and contains a 4-valent organic group X 1 Tetracarboxylic dianhydrides, for example, pyromellitic anhydride, diphenyl ether-3,3',4,4'-tetracarboxylic dianhydride, benzophenone-3,3',4,4' -Tetr...

Embodiment

[0162] Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited thereto. In Examples, Comparative Examples, and Production Examples, the physical properties of the negative photosensitive resin composition were measured and evaluated by the following methods.

[0163] (1) Weight average molecular weight

[0164] The weight average molecular weight (Mw) of each polyimide precursor was measured by gel permeation chromatography (standard polystyrene conversion). The column used in the measurement is the trade name Shodex 805M / 806M series column manufactured by Showa Denko Co., Ltd., the standard monodisperse polystyrene selects Shodex STANDARD SM-105 manufactured by Showa Denko Co., Ltd., and the developing solvent is N-methyl-2- For pyrrolidone, the detector used was Shodex RI-930, a trade name manufactured by Showa Denko.

[0165] (2) Adhesion test

[0166] The negative photosensitive resin composition...

manufacture example 1

[0175] Production Example 1 (Synthesis of Polymer A as (A) Polyimide Precursor)

[0176] Put 155.1g of 4,4'-oxydiphthalic dianhydride (ODPA) into a 2-liter detachable flask, add 131.2g of 2-hydroxyethyl methacrylate (HEMA) and 400ml of γ-butyrolactone , stirred at room temperature, and added 81.5 g of pyridine while stirring to obtain a reaction mixture. After the heat generation due to the reaction ended, it was naturally cooled to room temperature and left to stand for 16 hours.

[0177] Next, under ice cooling, a solution of 206.3 g of dicyclohexylcarbodiimide (DCC) dissolved in 180 ml of γ-butyrolactone was added to the reaction mixture over 40 minutes while stirring, and then added over 60 minutes while stirring. What suspends 93.0 g of 4,4'- diaminodiphenyl ether (DADPE) in 350 ml of γ-butyrolactone. After further stirring at room temperature for 2 hours, 30 ml of ethanol was added and stirred for 1 hour, and then, 400 ml of γ-butyrolactone was added. The precipitat...

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Abstract

The invention provides a manufacture method for a negative type photosensitive resin composition and a cured relief pattern, the negative type photosensitive resin composition can form a cured film with excellent adhesion with a substrate after low-temperature curing. The negative type photosensitive resin composition comprises: 100 mass parts of (A) particularly-structured polyimide precursor; 1-20 mass parts of (B) photopolymerization initiator; and 0.01-10 mass parts of (C) more than one monocarboxylic acid compound containing 2-30 carbons and selected from a functional group formed by hydroxyl group, ether group, and ester group.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a method for producing a cured relief pattern using the same, and a semiconductor device. Embossed patterns of films and interlayer insulating films, etc. Background technique [0002] Conventionally, polyimide resins having excellent heat resistance, electrical properties, and mechanical properties have been used as insulating materials for electronic components and passivation films, surface protection films, and interlayer insulating films of semiconductor devices. In this polyimide resin, what is provided in the form of a photosensitive polyimide precursor can be easily formed by thermal imidization treatment of the precursor coating, exposure, development, and curing. Thermal embossed pattern lamination. Compared with the conventional non-photosensitive polyimide, such a photosensitive polyimide precursor has the characteristic that the process can be shortened significantly. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/038G03F7/00H01L21/027
Inventor 藤田充
Owner ASAHI KASEI KK
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