Preparation method of phenolic resin for heat insulating shield

Abstract

The invention discloses a preparation method of phenolic resin for a heat insulating shield, comprising the following steps of: (1), adding phenol and formaldehyde in mol ratio of 1:(0.7-0.9) into a reaction kettle, then adding an acidic catalyst which is 0.5-3wt% of the phenol, stirring, insulating at 80-100 DEG C for 1-8 hours; (2), adding a polyester waste material which is 10-50wt% of the phenol into the reaction kettle, stirring evenly; (3), heating the mixture of the step (2) to 100-160 DEG C, distilling and dehydrating; and (4) performing reduced pressure distillation on the reaction product of the step (3) until the free phenol content is less than or equal to 0.5%. In the invention, the free phenol content is controlled to be less than or equal to 0.5%, on the one hand, the phenolic smell volatilized in the use process of the phenolic resin can be reduced, and on the other hand, the softening point of the phenolic resin can be improved. Due to the polyester waste material, the cost is greatly reduced on the premise that the use properties of the phenolic resin are unchanged.

Description

Technical field [0001] The invention relates to the field of organic polymer compounds and refractory materials, in particular to a phenolic resin for thermal insulation boards, and a preparation method thereof. Background technique [0002] At present, most of the thermal insulation panels produced by refractory plants use phenolic resin as the bonding agent. The main use of phenolic resin is that it has the advantages of strong adhesion, high temperature resistance, and high flexural strength. However, because the existing phenolic resin has harmful substances, such as Free phenol pollutes the environment and is harmful to the human body. Secondly, the phenolic resin itself is relatively expensive, which hinders the rapid development of the existing insulation panels. Although there are a small number of manufacturers that use other adhesives, such as rosin, polyester, water glass, etc., the thermal insulation board produced using rosin or polyester is brittle, and the thermal ...

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Problems solved by technology

Although there are also reports, as CN1031541A and CN1046547A have reported utilizing residues in dimethyl terephthalate and polyester production to produce insulation board bonding agent, CN1041166A has reported utilizing dimethyl terephthalate and ethylene terephthalate The ester undergoes polymerization and hydroxyl transesterification first, and then adds phenolic resin to make it compatible to obtain polyester modified phenolic resin; the polyester modified phenolic resin produced by the above patent has good performance, but because these polyester modified phenolic resin It has thermal curing properties, so the heating temperature and time control are very strict during the preparation, and it is easy to cause solidification

German patent 2415846 introduces the modification of phenolic resin by using the steamed slag of DMT or dimethyl terephthalate. The resin modified by this method has a low softening point and is not suitable for crushing into powdery resin. Low

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