Mechanical texturing method of monocrystalline wafer for solar cell
A technology for solar cells and monocrystalline silicon wafers, which is applied in the manufacture of circuits, electrical components, and final products. It can solve the problems of being unable to put into actual mass production, complex processes, and high prices, and is suitable for large-scale mass production and simple equipment. , low cost effect
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Embodiment 1
[0022] (1) Place the silicon wafer on the conveyor belt of the vacuum sandblasting machine, and set the conveyor belt speed to 8mm / s;
[0023] (2) The conveyor belt sends the silicon wafer to the vacuum blasting room, the blasting pressure of the nozzle main pipe is 0.55MPa, the nozzle pressure is 0.07MPa, and the number of nozzles is 10;
[0024] (3) The air source pressure is set to 0.4MPa;
[0025] (4) The silicon wafer passes through the sandblasting chamber at a speed of 8mm / s, and the surface of the silicon wafer is formed into a suede surface by polishing the silicon carbide sand in the sandblasting chamber;
[0026] (5) The conveyor belt transports the silicon wafer out of the sandblasting room, and the texturing is completed.
[0027] The pyramid size of monocrystalline silicon wafers prepared by this process is 2 μm, the conversion efficiency of monocrystalline silicon cells is 17.5%, and the light-induced attenuation is 0.6%.
Embodiment 2
[0029] (1) Place the silicon wafer on the conveyor belt of the vacuum blasting machine, and set the conveyor belt speed to 15mm / s;
[0030] (2) The conveyor belt sends the silicon wafer to the vacuum blasting room, adjust the blasting pressure of the nozzle main pipe to 0.85MPa, and the nozzle pressure to 0.12MPa, of which the number of nozzles is 20;
[0031] (3) The air source pressure is set to 0.6 MPa;
[0032] (4) The silicon wafer passes through the sandblasting chamber at a speed of 15mm / s, and the surface of the silicon wafer is formed into a suede surface by polishing the silicon carbide sand in the sandblasting chamber;
[0033] (5) The conveyor belt transports the silicon wafer out of the sandblasting room, and the texturing is completed.
[0034] The pyramid size of monocrystalline silicon wafers prepared by this process is 4 μm, the conversion efficiency of monocrystalline silicon cells is 17.7%, and the light-induced attenuation is 0.4%.
Embodiment 3
[0036] (1) Put 10 silicon wafers (125×125mm) on the conveyor belt of the vacuum blasting machine, and set the conveyor belt speed to 12mm / s;
[0037] (2) The conveyor belt sends the silicon wafer to the sandblasting room, and adjusts the sandblasting pressure, nozzle pressure and number of nozzles. The sandblasting pressure of the nozzle main pipe is 0.75MPa, the nozzle pressure is 0.09MPa, and the number of nozzles is set to 14;
[0038] (3) The air source pressure is set to 0.5 MPa;
[0039] (4) The silicon wafer passes through the sandblasting room at a speed of 12mm / s, and the surface of the silicon wafer is formed into a suede surface by polishing the silicon carbide sand in the sandblasting room;
[0040] (5) The conveyor belt transports the silicon wafer out of the sandblasting room, and the texturing is completed.
[0041] The pyramid size of monocrystalline silicon wafers prepared by this process is 5 μm, the conversion efficiency of monocrystalline silicon cells is ...
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