Material for producing slab of semiconductor chip, preparation method and application thereof

A semiconductor and chip technology, applied in the field of semiconductor chip slicing material and its preparation and application, can solve the problems of large consumption of grinding and polishing consumables, large consumption of resin, long curing time, etc., and achieves short sample preparation time and less grinding waste. , the observation effect is good

Inactive Publication Date: 2011-09-21
PEKING UNIV FOUNDER GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the defects of the semiconductor chip slice preparation method in the prior art, such as large resin consumption, long curing time, large consumption of grinding and polishing consumables, and the need for molds, the present invention provides a semiconductor chip slice material and a preparation method thereof

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] In this embodiment, the preparation method of semiconductor chip slice material is:

[0020] 1. Select two scrapped Si substrate wafers and cut them to a size slightly larger than the semiconductor chip to be tested;

[0021] 2. Use EpoxyBond 110 glue produced by Allied (belonging to epoxy resin adhesive in thermosetting adhesives) to fix the semiconductor chip to be tested between the above two discarded Si substrate wafers. The curing time was 125° C. for 15 minutes.

[0022] The application of the semiconductor chip slicing material prepared by the present embodiment:

[0023] The semiconductor chip slicing material prepared in this embodiment is fixed to a jig, ground and polished, and prepared into a semiconductor chip slicing.

[0024] The grinding and polishing steps are as follows:

[0025] 1. Use sandpaper with abrasive particles from large to small to grind step by step or grind step by step with suspensions containing different abrasive particle sizes. The...

Embodiment 2

[0029] In this embodiment, the preparation method of semiconductor chip slice material is:

[0030] 1. Select two scrapped Si substrate wafers and cut them to a size slightly larger than the semiconductor chip to be tested;

[0031] 2. Fix the semiconductor chip to be tested between two scrapped Si substrate wafers with the quick-drying glue 401 glue (belonging to the acrylic resin adhesive in the thermosetting adhesive) produced by Loctite. Curing at room temperature for 5 minutes.

[0032] The application of the semiconductor chip slicing material prepared by the present embodiment:

[0033] The semiconductor chip slicing material prepared in this embodiment is fixed to a jig, ground and polished, and prepared into a semiconductor chip slicing.

[0034] The grinding and polishing steps are as follows:

[0035] 1. Use sandpaper with abrasive particles from large to small to grind step by step or grind step by step with suspensions containing different abrasive particle siz...

Embodiment 3

[0039] In this embodiment, the preparation method of semiconductor chip slice material is:

[0040] 1. Select two scrapped Si substrate wafers and cut them to a size slightly larger than the semiconductor chip to be tested;

[0041] 2. At 200°C, within 1 minute, apply paraffin wax (a thermoplastic adhesive) provided by Allied on the surface to be bonded. After cooling, the semiconductor chip to be tested is fixed between two discarded Si substrate wafers.

[0042] The application of the semiconductor chip slicing material prepared by the present embodiment:

[0043] The semiconductor chip slicing material prepared in this embodiment is fixed to a jig, ground and polished, and prepared into a semiconductor chip slicing.

[0044] The grinding and polishing steps are as follows:

[0045] 1. Use sandpaper with abrasive particles from large to small to grind step by step or grind step by step with suspensions containing different abrasive particle sizes. The particle sizes of th...

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PUM

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Abstract

The invention relates to a material for producing a slab of semiconductor chip, a preparation method and an application thereof. The material for producing the slab of semiconductor chip disclosed in the invention has s sandwich structure, wherein, a middle layer of the sandwich structure is composed of a semiconductor chip to be examined, layers at two sides of the sandwich structure are composed of Si substrate wafers, a binder used for binding inorganic nonmetallic materials is adopted to bind the middle layer and the layers at two sides of the sandwich structure. The invention further provides the preparation method for preparing the material for producing a slab of semiconductor chip, and the application of the material for producing a slab of semiconductor chip in producing the slab of semiconductor chip. The material for producing the slab of semiconductor chip prepared by the method disclosed in the invention has good observation effect of electron micrographs, and can be prepared without mold or resins. Because section area of grinding and polishing is small, the consumption of materials in grinding and polishing is reduced, the production time of a sample is short, the production cost of the sample is low, and wastes in the preparing process can be minimized.

Description

technical field [0001] The invention relates to a semiconductor chip slice material and its preparation and application Background technique [0002] The semiconductor chip (that is, a wafer with an integrated circuit on the surface of a single crystal Si substrate, hereinafter referred to as a semiconductor chip) slice preparation method is a slice preparation method for observing the cross-sectional structure of a semiconductor chip by using destructive means. The slices prepared by the method can clearly observe the cross-sectional structure of the product, provide support for product production and analysis, and are widely used in the fields of semiconductor production, inspection, detection and testing. [0003] During the production or testing process of semiconductor chips, such as product failure, process improvement and new product development, it is necessary to observe the internal structure at certain specific positions. In general, the purpose of observing the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/28G01N1/32
Inventor 金波
Owner PEKING UNIV FOUNDER GRP CO LTD
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