The present disclosure relates to an automatic measurement method for
electron micrograph images obtained in a
semiconductor process. The method comprises: obtaining an
electron micrograph image to be analyzed as a first image; obtaining a region selected by a user in the first image as a first region, and obtaining information of a manual measurement operation performed by the user in the first region; obtaining a value of a specified image feature of the first region, and selecting one from a plurality of preset region matching algorithms as a first
algorithm based on the specified image feature value; obtaining a value of a specified edge feature related to the manual measurement operation information, and selecting one from a plurality of preset edge recognition algorithms as a second
algorithm based on the specified edge feature value; and recognizing at least one second region from the first image by using the first
algorithm, recognizing an edge to be measured in the second region by using the second algorithm, and performing automatic measurement by using the edge.