Simple paste for measuring surface deformation of material and production method thereof

Abstract

The embodiment of the invention discloses a simple paste for measuring the surface deformation of a material and a production method thereof. The method comprises the following steps of: providing a substrate; sticking an adhesive tape with a coarse surface onto the substrate; forming a reflecting layer on the adhesive tape, wherein the surface of the reflecting layer and the surface of the adhesive tape have high optical contrast ratios; forming graphs of grids, dot matrixes or grid lines on the adhesive tape by adopting a photoetching process; and separating the adhesive tape from the substrate, thus the simple paste for measuring the surface deformation of the material is obtained. In the embodiment of the invention, the grids, dot matrixes or grid lines with the diameter in micron or millimetre can be obtained by adopting the photoetching process, thus the dimension of a final grid / dot matrix can meet the requirements of a CCD (charge coupled device) camera and an automatic grid method to small-dimension grids / dot matrixes. Meanwhile, the characteristics of an ultraviolet photoetching technology cause the produced grids, dot matrixes or grid lines to be regular and uniform, the production technology is mature and simple, and the production period is short.

Description

technical field [0001] The invention relates to the technical field of material surface deformation measurement in experimental mechanics, in particular to a simple sticker for measuring material surface deformation and a manufacturing method thereof. Background technique [0002] The in-plane displacement and deformation measurement of the object surface in experimental mechanics mainly includes mechanical method, electrical measurement method and optical measurement method. Among them, the optical measurement method is widely used as a full-field non-contact measurement method. The optical measurement methods that appeared successively in the last century mainly include single-beam speckle imaging method, planar moiré method, moiré interferometry, electronic speckle interferometry, digital speckle correlation technology and automatic grid method. The automatic grid method prefabricates an orthogonal grid or an orthogonal lattice on the object, records two grid images befor...

AI Technical Summary

Problems solved by technology

[0010] The size of the grid / dot matrix produced by the above technology is often large, and it is difficult to ensure the production accuracy. Although the larger grid / dot matrix can improve the measurement accuracy, but the grid / dot matrix is ​​too large, the CCD camera There will be too few grids / lattices in the field of view, resulting in insufficient data volume, so the diameter of the grid / lattice should be the smallest size that does not affect the measurement accuracy

Moreover, with the development of high-resolution CCD cameras, the size of the grid / dot matrix that the camera itself can distinguish becomes smaller, and even a grid / dot matrix with a diameter of 100 microns and a pitch of 300 microns can be resolved. The size of the grid / dot matrix obtained by the second to fifth grid and lattice production methods is too large, which can no longer meet the needs of high-resolution CCD cameras.

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