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Surface treatment coarsening process for improving peel strength of copper foil
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A technology of peel strength and surface treatment, which is applied in the secondary treatment of printed circuits and the improvement of metal adhesion of insulating substrates. Needs and other issues to achieve the effect of improving peel strength, increasing crystallization nuclei, and increasing the surface area of copper foil matte surface
Active Publication Date: 2012-11-14
SHANDONG JINBAO ELECTRONICS
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As early as 2003, the European Union's "Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" (referred to as the ROHS Directive) stipulated that all member states will ensure that new electronic products placed on the market from July 1, 2006 Electrical equipment cannot contain lead, mercury, cadmium, hexavalent chromium, polybrominated diphenyl ether (PBDE) or polybrominated biphenyl (PBB), which are dangerous to human health and the environment. Most of the flame retardants are bromine-based. Due to restrictions on use, many manufacturers have developed halogen-free and lead-free copper clad laminates. Due to changes in flame retardants, curing agents, and fillers, the peeling strength of the copper foil of the board has dropped significantly. The previous Copper foil surface treatment process can no longer meet the needs of halogen-free lead-free copper clad laminates
[0003] The original liquid-making process of the surface treatment roughening liquid is: add cathode copper, concentrated sulfuric acid, soft water, steam, and compressed air into the copper-dissolving tank in proportion to dissolve, and generate a copper sulfate solution, which is then circulated to the roughening low-level tank, and then The pump pumps into the roughening tank of the surface treatment machine, sends power to electroplating, and then overflows back into the low-level tank and the copper-dissolving tank. This roughening process produces fewer copper foil crystal nuclei, and they are all concentrated on the rough surface of the copper foil. At the top, it cannot meet the requirements for peel strength of halogen-free and lead-free copper clad laminates
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Embodiment 1
[0021] A surface treatment roughening process capable of improving the peel strength of copper foil, the specific process steps are as follows:
[0024] 3. After mixing fully, enter the roughening tank for electroplating;
[0025] Its process requirements range from Cu 2+ 10g / l,H 2 SO 4 160g / l, the temperature is 25℃; the electroplating current density is 0.3A / cm 2 , Plating time 6S, in this range can improve the peel strength used in halogen-free lead-free copper clad laminates.
[0026] Described additive is: surfactant (SDBS), Fe 2+ Compound, Co 2+ The process ranges of compounds and additives are: Surfactant SDBS: 0.1g / l, Fe 2+ : 1g / l, Co 2+ : 1g / l; in this range, the rough surface of the copper foil can increase the crystalnucleus.
Embodiment 2
[0028] The difference between this embodiment and embodiment 1 is that
[0029] The process requirements range from Cu 2+ 18g / l,H 2 SO 4 200g / l, the temperature is 40℃; the electroplating current density is 0.5A / cm 2 , plating time 8S;
[0030] The process range of the additive is surfactant SDBS: 0.5g / l, Fe 2+ : 4g / l, Co 2+ : 2g / l.
Embodiment 3
[0032] The difference between this embodiment and embodiment 1 is that
[0033] The best range of process requirements is: Cu 2+ 16g / l,H 2 SO 4 195g / l, the temperature is 28°C, the current density of electroplating is 0.45A / cm 2 , Plating time 7S, this range increases the maximum peel strength.
[0034] The optimal process range of the additive is: SDBS: 0.4g / l, Fe 2+ : 3g / l, Co 2+ : 2g / l; this range increases the most crystallization nuclei on the rough side of the copper foil.
[0035] The peeling strength obtained through experiment of the present invention and the result of visual observation rough surface state are as following table
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peel strength
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Abstract
The invention relates to a surface treatment coarsening process for improving the peel strength of copper foil, and belongs to the technical field of the production of the surface treatment of electrolytic copper foil. The surface treatment coarsening process is characterized in that: several additives are added on the basis of the original coarsening liquid to form mixed solution of 'copper and A and B', and alloy plating is adopted, so that more copper foilcrystallization nuclei are produced under process requirements on concentration, temperature, current density and electroplating time and are distributed on the large part of the rough surface of the copper foil completely. Therefore the peel strength of the copper foil of a halogen-free and lead-free copper-clad plate can be improved effectively.
Description
technical field [0001] The invention relates to a surface treatment roughening process capable of improving the peeling strength of copper foil, and belongs to the technical field of electrolytic copper foil surface treatment production. Background technique [0002] Electrode posited copper foil is the basic material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB). As early as 2003, the European Union's "Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" (referred to as the ROHS Directive) stipulated that all member states will ensure that new electronic products placed on the market from July 1, 2006 Electrical equipment cannot contain lead, mercury, cadmium, hexavalent chromium, polybrominated diphenyl ether (PBDE) or polybrominated biphenyl (PBB), which are dangerous to human health and the environment. Most of the flame retardants are bromine-based. Due to restrictions on u...
Claims
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