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Positive radiation sensitive composition, interlayer insulation film and forming method thereof

A radiation and sensitivity technology, applied in the field of positive-type radiation-sensitive compositions, can solve the problems of prolonging the development time and reducing the formability of the developable pattern, and achieves fine and detailed patterns, excellent developability, pattern formation, and coping. high effect

Active Publication Date: 2014-08-06
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when an interlayer insulating film is formed using a conventional radiation-sensitive resin composition as described above, for example, when prebaking is performed at a relatively low temperature after coating, or the development time is prolonged due to equipment failure in the development process, In some cases, etc., the developability and even the pattern formability may be reduced.
That is, the existing radiation-sensitive resin composition cannot sufficiently cope with the variation of the cured film formation conditions in the actual manufacturing site, and there is room for improvement in this point.

Method used

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  • Positive radiation sensitive composition, interlayer insulation film and forming method thereof
  • Positive radiation sensitive composition, interlayer insulation film and forming method thereof
  • Positive radiation sensitive composition, interlayer insulation film and forming method thereof

Examples

Experimental program
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Effect test

Synthetic example 1

[0285] In a flask with a condenser tube and a stirrer, 7 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol ethyl methyl ether were added. Then, add 5 parts by mass of methacrylic acid, 40 parts by mass of 1-ethoxyethyl methacrylate, 5 parts by mass of styrene, 40 parts by mass of glycidyl methacrylate, 10 parts by mass of 2-methacrylic acid Hydroxyethyl ester and 3 parts by mass of α-methylstyrene dimer were replaced with nitrogen, and then slowly stirred. The temperature of the solution was raised to 70° C., and the temperature was maintained for 5 hours to obtain a polymer solution containing the polymer (A-1). The polystyrene-equivalent mass average molecular weight (Mw) of the polymer (A-1) was 9,000. In addition, the solid content concentration (the ratio of the mass of the polymer contained in the polymer solution to the total mass of the polymer solution; the same applies hereinafter) of the polymer solution obtained her...

Synthetic example 2

[0287] In a flask with a condenser tube and a stirrer, 7 parts by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol ethyl methyl ether were added. Then, add 5 parts by mass of methacrylic acid, 40 parts by mass of tetrahydro-2H-pyran-2-yl methacrylate, 5 parts by mass of styrene, 40 parts by mass of glycidyl methacrylate, 10 parts by mass of methyl 2-hydroxyethyl acrylate and 3 parts by mass of α-methylstyrene dimer were replaced with nitrogen, and then slowly stirred. The temperature of the solution was raised to 70° C., and the temperature was maintained for 5 hours to obtain a polymer solution containing the polymer (A-2). The polystyrene-equivalent mass average molecular weight (Mw) of the polymer (A-2) was 9,000. In addition, the solid content concentration of the polymer solution obtained here was 31.3 mass %.

Synthetic example 3

[0289] In a flask with a condenser and a stirrer, 7 parts by mass of 2,2'-azobis(2-methylpropionate) and 200 parts by mass of propylene glycol monomethyl ether acetate were added. Next, 67 parts by mass of 1-n-butoxyethyl methacrylate, 23 parts by mass of benzyl methacrylate, and 10 parts by mass of methacrylic acid were added and replaced with nitrogen, followed by slow stirring. The temperature of the solution was raised to 80°C, and the temperature was maintained for 6 hours to obtain a polymer solution containing the polymer (a-1). The polystyrene-equivalent mass average molecular weight (Mw) of the polymer (a-1) was 9,000. In addition, the solid content concentration of the polymer solution obtained here was 30.3 mass %.

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Abstract

The invention relates to a positive radiation sensitive composition, an interlayer insulation film and a forming method thereof. The invention aims to provide a positive radiation sensitive composition, an interlayer insulation film formed by the composition and a method for forming the interlayer insulation film. The positive radiation sensitive composition has excellent radiation sensitivity. The obtained interlayer insulation film which has high light transmittance and a high voltage conservation rate further has good development and excellent pattern forming performance by which the interlayer insulation film can deal with forming condition changes of curing films. The invention relates to a positive radiation sensitive composition having a polymer (A) provided with a structural unit representing a group in formula (1) in the same or different polymer molecules and an epoxy radical structural unit, a light acid generation agent (B) and long alkyl group compound (C).

Description

technical field [0001] The present invention relates to a positive radiation-sensitive composition, an interlayer insulating film formed from the composition, and a method for forming the interlayer insulating film. The positive radiation-sensitive composition is suitable for forming liquid crystal display elements (LCD), organic Materials for interlayer insulating films of display devices such as EL display devices (OLEDs). Background technique [0002] In a display element, an interlayer insulating film is generally provided for the purpose of insulating between wirings arranged in layers. A positive type radiation-sensitive composition is widely used as a material for forming an interlayer insulating film because the number of steps required to obtain a required pattern shape is small and it is preferable to have sufficient flatness. The positive radiation-sensitive composition used for forming such an interlayer insulating film requires good radiation sensitivity and th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/039G03F7/004G03F7/00
CPCG03F7/004G03F7/0045G03F7/039G03F7/0392H01L21/027H01L21/0271
Inventor 一户大吾
Owner JSR CORPORATIOON
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