Wet silicon carbide sand for solar silicon chip wire cutting

Abstract

The invention relates to wet silicon carbide sand for solar silicon chip wire cutting. The wet silicon carbide sand is characterized by consisting of auxiliary agent, process assisted carrier and silicon carbide sand, wherein the auxiliary agent comprises nano film forming agent for sand surface modification, dispersant, surfactant, defoaming agent and metal corrosion inhibitor, and the weight percentage of the auxiliary agent is 0.5 to 15 percent; the process assisted carrier is polyethylene glycol, and the weight percentage of the process assisted carrier is 5 to 45 percent; and the balance is the silicon carbide sand. The wet silicon carbide sand is different from the traditional dry silicon carbide sand in supply and using mode, has no dust pollution, and accords with the production concept of greenness and environment friendliness; by using the wet silicon carbide sand for preparing cutting mortar, better stability of product quality, higher cutting yield and lower comprehensive cost of the cutting mortar are ensured; the time required for preparing the cutting mortar by a user is shortened to one third, and the operating cost is low; and due to very good re-dispersibility, the slicing efficiency of a wire cutter is greatly improved.

Description

technical field [0001] The invention relates to a product used for wire cutting of silicon wafers, in particular to a wet silicon carbide sand material used for wire cutting of solar silicon wafers. Background technique [0002] China's photovoltaic power generation industry has ushered in a new stage of rapid development in the past five years. Under the powerful pull of the world's photovoltaic market, my country's photovoltaic power generation industry has developed rapidly. Solar silicon wafer cutting equipment has been put into operation several times and dozens of times in the past three years. Among them, the demand for silicon carbide micro-sand for cutting has reached about 800-900 tons per day. [0003] In the process of wire cutting of solar silicon wafers, the whole mechanism is to use the hard characteristics and sharp water chestnuts of silicon carbide particles to gradually cut off the silicon rods. Therefore, the main characteristics of the cutting mortar h...

AI Technical Summary

Problems solved by technology

The main problem is that there are many types of cutting sand and liquid in the market, and there are many unstable qualities. The small amount of manual sand mixing each time results in many batches, and human factors have a great influence

This results in high cost of production management and storage, weak cutting ability of the slicing machine, unstable equipment efficiency, high slicing cost and other shortcomings. The cost reduction in the future market competition will affect the development of the entire industry. All enterprises are trying to improve silicon Making unremitting efforts to improve chip quality and reduce cutting costs

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