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Slurry supplying system in chemical mechanical polishing

A chemical machinery and supply system technology, applied in mechanical equipment, machine/engine, grinding/polishing equipment, etc., can solve problems such as easy pollution of vacuum chamber, aggregation of abrasive particles, uneven flow of abrasive liquid, etc., to reduce downtime Effect of time, smooth flow, reduction and maintenance cost

Inactive Publication Date: 2011-11-09
WUHAN XINXIN SEMICON MFG CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a grinding liquid supply system in chemical mechanical grinding, so as to solve the problem that the grinding liquid supply system in the chemical mechanical grinding process is easy to produce grinding liquid particle aggregation, uneven flow of grinding liquid and easy pollution of the vacuum chamber. Problems with other fine dust particles

Method used

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  • Slurry supplying system in chemical mechanical polishing
  • Slurry supplying system in chemical mechanical polishing
  • Slurry supplying system in chemical mechanical polishing

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Embodiment Construction

[0013] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0014] The processing method of the present invention can be widely applied to many processes, and can be made of a variety of suitable materials. The following is a preferred embodiment to illustrate, of course, the present invention is not limited to this specific embodiment. The general substitutions known to those of ordinary skill in the art are undoubtedly covered by the protection scope of the present invention.

[0015] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention, for convenience of description, the schematic diagrams are not partially enlarged according to a general scale and should not be used as a limitation to the pre...

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Abstract

The invention provides a slurry supplying system in chemical mechanical polishing. In the system, a pump unit is a magnetic suspension pump; a slurry accommodation barrel is connected with the slurry inlet of the magnetic suspension pump through a pipeline; the slurry is conveyed to a slurry supplying outlet from the slurry outlet of the magnetic suspension pump through a pipeline; the slurry supplying outlet comprises a slurry backflow outlet which is connected with the slurry accommodation barrel through a pipeline to form a backflow passage; and a pressure sensor is arranged on the backflow passage and is connected with a controller which is connected with the control voltage input end of the magnetic suspension pump. The slurry supplying system ensures that slurry particles are not easy to gather, and the flow of the slurry is stable, and solves the problem that the oil vapor generated by lubricating grease brought by using lubricating oil in the conventional bearing flows back to pollute a vacuum chamber.

Description

Technical field [0001] The invention relates to the technical field of chemical mechanical polishing in semiconductor manufacturing, in particular to a polishing liquid supply system in chemical mechanical polishing. Background technique [0002] As an indispensable process in chip processing, chemical mechanical polishing (CMP) is not only used in the wafer preparation stage, but also used to flatten the wafer surface during the wafer processing process. The chemical mechanical polishing method mainly uses the principle of mechanical polishing, and cooperates with the chemical additives in the polishing liquid to react with the chip surface to smooth the uneven contour of the chip surface. Generally, if the parameters of various processes are properly controlled, chemical mechanical polishing can provide a flatness of more than 94% of the polished surface. However, with the development of the semiconductor industry, the integrated circuit manufacturing industry is developing rap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B57/02F04D13/02
Inventor 陈威王怀锋詹明松曹开玮
Owner WUHAN XINXIN SEMICON MFG CO LTD
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