Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby

An LED bracket and surface mount technology, applied in electrical components, circuits, semiconductor devices, etc., to achieve high heat resistance requirements, strong popularity, and low cost.
CN102237481AActive Publication Date: 2011-11-09FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
Publication Date
2011-11-09

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Abstract

The invention relates to a surface mounted type power light-emitting diode (LED) bracket manufacturing method and a product manufactured thereby. The method comprises the following steps of: 1) preparing a copper-clad printed circuit board (PCB) single-sided board of which the glass transition temperature Tg ranges from 140 to 165 DEG C and the thermal degradation temperature Td is not less than 300 DEG C; 2) forming at least one through hole passing through the single-sided board through a mechanical or laser process; 3) adhering and covering a metal sheet on the lower surface of the single-sided board, and sealing the bottom of the through hole; 4) forming a line layer I on a copper layer of the single-sided board and a line layer II on the metal sheet so as to form an LED bracket; and 5) cutting the LED bracket to separate independent LED bracket units. The invention also provides the surface mounted type power LED bracket manufactured by the method. By the invention, the prejudicein the prior art is overcome; a common PCB is used as a substrate for manufacturing a power LED bracket; furthermore, the process method is simple, the structural design is unique, the product cost is low, the universality is high, the heat dissipation effect is good, the application range is wide and the invention is suitable for industrial batch production.
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Description

technical field

[0001] The invention relates to a method for manufacturing an LED bracket applied to an LED device and a product thereof, in particular to a method for manufacturing a surface mount type power LED device bracket and a product thereof. Background technique

[0002] Semiconductor lighting is known as the fourth-generation lighting source, and it is gradually popularized and applied to the field of general lighting. Among them, power light-emitting diodes (power LEDs) are popular in the market for their high brightness and high power. There are two types of brackets for conventional power LEDs: PLCC type (plastic led chip carrier, plastic lead chip carrier) and ceramic substrate.

[0003] as attached figure 1 Shown is a schematic diagram of the structure of the PLCC-type stent in the prior art. The PLCC-type bracket is a plastic shell 01 with a reflective cavity structure that wraps a metal lead frame 02. The metal lead frame 02 has a chip placement part 03 c...

Claims

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