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Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby

An LED bracket and surface mount technology, applied in electrical components, circuits, semiconductor devices, etc., to achieve high heat resistance requirements, strong popularity, and low cost.

Active Publication Date: 2011-11-09
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing technical improvements, those skilled in the art have tried in terms of manufacturing materials and manufacturing techniques, but none of them have solved and overcome the above-mentioned technical defects well.

Method used

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  • Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby
  • Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby
  • Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] image 3 The flow chart of the manufacturing method of the surface mount type power LED bracket unit of the present invention is given, and the following is combined with the attached image 3 Be specific.

[0036] Such as image 3 As shown, the manufacturing method of the surface mount type power LED bracket and its unit is as follows: step 1) preparing a single copper clad PCB; through holes; step 3) covering a metal sheet on the lower surface of the copper-clad PCB single-sided board with an adhesive material, and sealing the bottom of the through-hole; step 4) in the copper-clad PCB single-sided board Forming the circuit layer 1 on the layer, forming the circuit layer 2 on the metal sheet; 5) cutting the LED bracket to split into independent LED bracket units.

[0037] In step 1), the copper-clad PCB single-sided insulating board is composed of a copper layer and a PCB insulating flat plate carrying the copper layer. In order for the LED device to withstand the ...

Embodiment 2

[0050] Figure 4 An embodiment of a surface-mounted power LED bracket unit of the present invention is given, and its structure is now combined with the attached Figure 4 Be specific.

[0051] Such as Figure 4 As shown, a surface mount type power LED bracket unit 1, Figure 4 Shown in A is a schematic diagram of the upper surface structure of the support unit, Figure 4 B shows the schematic diagram of its lower surface structure, Figure 4 C shows its cross-sectional view, and the structure of the illustrated LED bracket unit includes: a copper-clad PCB single-sided board with a through hole 101, wherein the copper-clad PCB single-sided board is made of a copper circuit layer 12 and carries the An ordinary PCB insulating plate 10 with a copper layer is composed of a chip placement portion 11 arranged on the lower surface of the insulating plate 10 and sealing the bottom of the through hole 101 , and a circuit layer 12 arranged on the insulating plate 10 . Wherein, the ...

Embodiment 3

[0056] Figure 5 Another specific embodiment of a surface-mounted power LED bracket unit 1 of the present invention is given. Attached below Figure 5 Describe its structure in detail.

[0057] The difference between the present embodiment three and the preceding embodiment two lies in the structure of the positive and negative electrodes 13: as attached Figure 5 As shown, the positive or negative electrode 13 is composed of at least one small through hole 131 penetrating the insulating plate 10 and the circuit layer 12 and a conductive material 133 filling the small through hole 131 . Wherein, the conductive material 133 is electrically connected to the circuit layer 12 . Among them, the preferred number of small through holes is three, and the conductive material 133 is preferably silver paste

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PUM

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Abstract

The invention relates to a surface mounted type power light-emitting diode (LED) bracket manufacturing method and a product manufactured thereby. The method comprises the following steps of: 1) preparing a copper-clad printed circuit board (PCB) single-sided board of which the glass transition temperature Tg ranges from 140 to 165 DEG C and the thermal degradation temperature Td is not less than 300 DEG C; 2) forming at least one through hole passing through the single-sided board through a mechanical or laser process; 3) adhering and covering a metal sheet on the lower surface of the single-sided board, and sealing the bottom of the through hole; 4) forming a line layer I on a copper layer of the single-sided board and a line layer II on the metal sheet so as to form an LED bracket; and 5) cutting the LED bracket to separate independent LED bracket units. The invention also provides the surface mounted type power LED bracket manufactured by the method. By the invention, the prejudicein the prior art is overcome; a common PCB is used as a substrate for manufacturing a power LED bracket; furthermore, the process method is simple, the structural design is unique, the product cost is low, the universality is high, the heat dissipation effect is good, the application range is wide and the invention is suitable for industrial batch production.

Description

technical field [0001] The invention relates to a method for manufacturing an LED bracket applied to an LED device and a product thereof, in particular to a method for manufacturing a surface mount type power LED device bracket and a product thereof. Background technique [0002] Semiconductor lighting is known as the fourth-generation lighting source, and it is gradually popularized and applied to the field of general lighting. Among them, power light-emitting diodes (power LEDs) are popular in the market for their high brightness and high power. There are two types of brackets for conventional power LEDs: PLCC type (plastic led chip carrier, plastic lead chip carrier) and ceramic substrate. [0003] as attached figure 1 Shown is a schematic diagram of the structure of the PLCC-type stent in the prior art. The PLCC-type bracket is a plastic shell 01 with a reflective cavity structure that wraps a metal lead frame 02. The metal lead frame 02 has a chip placement part 03 c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/64
Inventor 余彬海夏勋力李伟平李程梁丽芳
Owner FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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