A method of growing non-polar surface aln template on silicon substrate
A non-polar surface, silicon substrate technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem that non-polar surface GaN templates cannot be used to grow non-polar surface AlGaN, template surface cracks, Surface unevenness and other problems, to achieve the effect of simple method, improved efficiency and broad application prospects
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specific Embodiment approach 1
[0020] Specific implementation mode 1. Combination figure 1 Describe this embodiment mode, a kind of method for growing non-polar surface AIN template on silicon substrate, this method is realized by the following steps:
[0021] Step 1. Select a silicon substrate;
[0022] Step 2, using photolithography to prepare a strip photoresist mask pattern on the silicon substrate selected in step 1;
[0023] Step 3, using electron beam evaporation to evaporate a mask on the photoresist mask pattern prepared in step 2, and then using Lift Off technology to obtain a patterned mask pattern;
[0024] Step 4, using wet etching technology to selectively etch silicon substrates with different crystal planes to obtain a silicon (111) plane that forms a fixed angle with the silicon surface;
[0025] Step 5, using MOCVD to grow an AlN buffer layer on the silicon surface described in step 4, and then using high-temperature MOCVD to continue growing AlN templates to obtain AlN templates with no...
specific Embodiment approach 2
[0031] Specific embodiment two, combine figure 2 , image 3 and Figure 4 This implementation mode is described. This implementation mode is an example of a method for growing a non-polar surface AIN template on a silicon substrate as described in the first specific implementation mode:
[0032] combine figure 2 , select a silicon substrate, and the silicon substrate is a silicon (110) substrate.
[0033] A photoresist mask pattern is prepared on the silicon (110) surface substrate by photolithography technology, the mask pattern is strip-shaped, the window size width is 3-10 μm, and the distance between adjacent windows is 3-10 μm.
[0034] Then utilize electron beam evaporation technology to vaporize 30~50nm tungsten on the sample surface with photoresist mask pattern, make the window place that does not have photoresist in photoresist mask pattern, tungsten is directly deposited on the silicon (110) substrate 13 ; Where the photoresist remains in the photoresist mask ...
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