Manufacture method of printed circuit board with surface-pressure covering film

Abstract

The invention relates to a printed circuit, in particular to a manufacture method of a printed circuit board with a surface-pressure covering film. The manufacture method of the printed circuit board with the surface-pressure covering film comprises the following steps of: rough shape cutting; exposure of inner layer lines of a core plate, etching of circuit patterns after development; stitching;boring; copper deposition and bore metallization; pressure and development of outer layer lines; electroplating of patterns; outer layer etching; screen printing and resistance welding; full board gold deposition; and pressing of polyimide film. The manufacture method has the advantages that the short circuit problem occurred during the mounting process of the printed circuit board can be efficiently solved, the electrical performance of the product can be guaranteed, the exposed copper on the circuit board is prevented from being contacted with the air to cause oxidizing reaction, the circuit board is protected from being scraped.

Description

technical field [0001] The invention relates to a printed circuit, in particular to a method for producing a printed circuit board with a surface pressure covering film. Background technique [0002] At present, since the integrated chip mounted on the circuit board generates a lot of heat during operation, in order to protect the chip, it is necessary to use metal sheets to dissipate heat on both sides of the chip. If no insulation treatment is used, such a large metal sheet attached to the surface of the circuit board must be Causes a short circuit between holes in the circuit board. If solder mask is used for insulation treatment, there are two problems as follows: 1. When all via holes and solder mask ink are sealed: if solder mask is used to seal the holes, in the harsh environment and due to the continuous occurrence of cold for a long time Thermal sudden change (the heat generated during work is high, the temperature is high, and when it is not working, it will drop ...

AI Technical Summary

Problems solved by technology

[0002] At present, since the integrated chip mounted on the circuit board generates a lot of heat during operation, in order to protect the chip, it is necessary to use metal sheets to dissipate heat on both sides of the chip. If no insulation treatment is used, such a large metal sheet attached to the surface of the circuit board must be Short circuit between circuit board holes

If solder mask is used for insulation treatment, there are two problems as follows: 1. When all via holes and solder mask ink are sealed: if solder mask is used to seal the holes, in the harsh environment and due to the continuous occurrence of cold for a long time Thermal sudden change (the heat generated during work is high, the temperature is high, and when it is not working, it will drop to the ambient temperature, the temperature is about minus 10 degrees), and the solder mask of these holes is also prone to delamination and blistering, which eventually leads to the peeling off of the solder mask ;The plug-in hole needs to be welded with components, and if the hole is fully sealed, the component cannot be soldered; only half of the hole is sealed: if only half of the hole is sealed without affecting the welding of components, the current process is not well done. make

2. When the via hole is not sealed: one-sided cover hole is not sealed or double-sided window is not sealed: the solder paste will flow from the hole to the lower surface when the component is soldered, and the contact with the heat sink will also cause short circuit between holes