Method for manufacturing topological type binary diffractive optical element through HSQ (hydrogen silsesquioxane) process

A binary diffraction and optical element technology, applied in the direction of diffraction grating, etc., can solve problems such as difficulty in ensuring flatness, affecting product quality, and high cost of use, and achieve the effect of improving limit resolution, high resolution, and reducing production costs

Inactive Publication Date: 2012-01-11
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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Problems solved by technology

Phase-type binary diffractive optical elements are usually produced by etching, which has the disadvantages of high cost and low efficiency
[0006] Especially for phase-type binary diffractive optical elements with protrusions, the commonly used plasma etching equipment will etch away most of the substrate area on the substrate and only leave the pattern part. This method not only costs It is expensive, takes a long time, and the result obtained is difficult to ensure the flatness of a large area, which affects product quality and low production efficiency

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  • Method for manufacturing topological type binary diffractive optical element through HSQ (hydrogen silsesquioxane) process
  • Method for manufacturing topological type binary diffractive optical element through HSQ (hydrogen silsesquioxane) process
  • Method for manufacturing topological type binary diffractive optical element through HSQ (hydrogen silsesquioxane) process

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Embodiment Construction

[0037] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0038] Such as figure 2 Shown, the phase-type binary diffractive optical element used in the present invention is a raised two-step phase-type photon sieve, which consists of: A, quartz substrate, the diameter of which is 6.25cm, and a thickness of 3mm; B, on the quartz substrate Plated with metal chromium film, the thickness is about 60nm; C, the metal chromium film is composed of plane light-transmitting holes and raised light-transmitting holes randomly distributed on the metal chromium film. The design parameters are: the diameter of the photon sieve is 20mm, the design wavelength is 355nm, the focal length is 0.1m, and the diameter of the outermost ring hole is 2.7μm.

[0039] The randomly distributed light-transmi...

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Abstract

The invention discloses a method for manufacturing a topological type binary diffractive optical element through an HSQ (hydrogen silsesquioxane) process, which comprises: A, preparing a mask plate of the binary diffractive optical element; B, coating hydrogen silsesquioxane glue on a substrate, photoetching the substrate with the mask plate, drying, and steaming a metal film; C, selectively removing the metal film on the substrate via electrochemical corrosion; and D, drying the substrate, and thus obtaining the topological type binary diffractive optical element. Compared with the traditional etching method, the invention has the advantages that the manufacturing process is simple, the cost is low, the stability is good, higher resolution can be achieved, and the large-scale promotion and application of the method can be facilitated.

Description

technical field [0001] The invention belongs to the technical field of diffractive optical elements, and in particular relates to a method for manufacturing phase-type binary diffractive optical elements by using the HSQ process. Background technique [0002] The binary diffractive optical element was first proposed by the Massachusetts Institute of Technology in the late 1980s. The control of the phase in the binary optical element is to approach the ideal value by generating multiple steps, and its logical diffraction efficiency is higher than that of the planar amplitude diffractive optical element. For example, the phase step is 2π, you can press L=2, 4, 8,..., 2 m equal method to divide. [0003] In the existing manufacturing process, this binary phase step can be easily completed by microelectronics technology. Using one mask for exposure and etching can produce two levels of steps, and using m masks for repeated overlay exposure and etching, you can get 2 m level ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/18
Inventor 谢常青潘一鸣朱效立刘明
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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