High heat conduction and high attenuation backing material for ultrasonic phased array probe and manufacturing method thereof

An ultrasonic phased array, high thermal conductivity technology, applied in the direction of material analysis, heat exchange materials, and analysis materials using sonic/ultrasonic/infrasonic waves. It can improve the mass percentage, the source of raw materials is easy, and the price is not high.

Inactive Publication Date: 2012-02-01
广州多浦乐电子科技股份有限公司
View PDF10 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the backing material of the present invention has the characteristics of high thermal conductivity, high attenuation and relatively low acoustic impedance, using the ultrasonic phased array probe made of the backing material solves the problem of When working, due to the low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High heat conduction and high attenuation backing material for ultrasonic phased array probe and manufacturing method thereof
  • High heat conduction and high attenuation backing material for ultrasonic phased array probe and manufacturing method thereof
  • High heat conduction and high attenuation backing material for ultrasonic phased array probe and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The high thermal conductivity and high attenuation backing material suitable for ultrasonic phased array probes of the present invention is composed of lutetium trioxide, alumina, composite tungsten powder and epoxy adhesive, wherein alumina accounts for the mass fraction of the backing material 26.52% of the aluminum oxide is produced by Shanghai Gona Powder Technology Co., Ltd. The particle size is 1500 mesh and the density is 4.0g / cm 3 , Lutetium trioxide accounts for 26.52% of the mass fraction of the backing material. Lutetium trioxide is produced by Guangzhou Weber Chemical Co., Ltd. The particle size is 400 mesh and the density is 9.4g / cm. 3 ; Composite tungsten powder accounts for 39.79% of the mass fraction of the backing material. It is made by mixing rubber and tungsten powder with a particle size of 0.5mm.

[0031] Epoxy adhesive is made by stirring and mixing epoxy resin E-54 and triethanolamine, among which epoxy resin E-54 and triethanolamine are made by Guang...

Embodiment 2

[0041] The high thermal conductivity and high attenuation backing material suitable for ultrasonic phased array probes of the present invention is composed of lutetium trioxide, alumina, composite tungsten powder and epoxy adhesive, wherein alumina accounts for the mass fraction of the backing material 10.48% of the alumina, the particle size is 1500 mesh produced by Shanghai Gona Powder Technology Co., Ltd., and the density is 4.0g / cm 3 , Lutetium trioxide accounts for 42.56% of the mass fraction of the backing material. Lutetium trioxide is produced by Guangzhou Weber Chemical Co., Ltd. The particle size is 400 mesh and the density is 9.4g / cm. 3 ; Composite tungsten powder accounts for 39.79% of the mass fraction of the backing material. It is made by mixing rubber and tungsten powder with a particle size of 0.5mm.

[0042] Epoxy adhesive is made by stirring and mixing epoxy resin E-54 and triethanolamine, among which epoxy resin E-54 and triethanolamine are made by Guangzhou Che...

Embodiment 3

[0050] The high thermal conductivity and high attenuation backing material suitable for ultrasonic phased array probes of the present invention is composed of lutetium trioxide, alumina, composite tungsten powder and epoxy adhesive, wherein alumina accounts for the mass fraction of the backing material 42.56% of the aluminum oxide is produced by Shanghai Gona Powder Technology Co., Ltd. The particle size is 1500 mesh and the density is 4.0g / cm 3 , Lutetium trioxide accounts for 10.48% of the mass fraction of the backing material. Lutetium trioxide is produced by Guangzhou Weber Chemical Co., Ltd. The particle size is 400 mesh and the density is 9.4g / cm. 3 ; Composite tungsten powder accounts for 39.79% of the mass fraction of the backing material. It is made by mixing rubber and tungsten powder with a particle size of 0.5mm.

[0051] Epoxy adhesive is made by stirring and mixing epoxy resin E-54 and triethanolamine, among which epoxy resin E-54 and triethanolamine are made by Guang...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Granularityaaaaaaaaaa
Densityaaaaaaaaaa
Granularityaaaaaaaaaa
Login to view more

Abstract

A high heat conduction and high attenuation backing material for ultrasonic phased array probe is made from lutecium oxide, alumina, a tungsten compound material and an epoxy adhesive and is characterized in that the epoxy adhesive is prepared by mixing epoxy resin E-54 and triethanolamine; the tungsten compound material is prepared by mixing rubber and a tungsten powder; and the alumina accounts for 10.48-53.04wt% of the backing material. A manufacturing method of the backing material comprises the following steps of: (a) mixing the epoxy resin E-54, lutecium oxide, alumina and the tungsten compound material with stirring, wherein the epoxy resin E-54 accounts for 6.22% the total weight of the backing material and alumina accounts for 10.48-53.04wt% of the backing material; (b) adding triethanolamine which accounts for 0.95% the total weight of the backing material into the above composite particles with stirring; (c) putting the composite particles into a die, and extruding the composite particles into the required backing material by the use of a powder pressing machine; and (d) putting the pressed backing material into an air-blasting heating oven of 65 DEG C for heating-curing. The thermal conductivity of the backing material is 1.782W/(m.k), its specific acoustic impedance is 8.42*106Pa.s/m and its acoustic attenuation coefficient at 5MHz is 294.4dB/cm. The backing material has high thermal conductivity and high attenuation. In addition, the sensitivity and resolution of the phased array probe produced by the use of the backing material can satisfy the requirement for application.

Description

Technical field [0001] The invention relates to a backing material with high thermal conductivity and high attenuation for ultrasonic phased array probes and a manufacturing method thereof. Background technique [0002] Using the ultrasonic phase array probe at high sound intensity or for a long time continuously will cause the internal components of the transducer to become too hot, which will have a great impact on the performance and detection results of the probe, and even affect the probe Life. Since the criteria for selecting transducer elements are based on their acoustic performance, the thermal conductivity of transducer elements with excellent acoustic performance is usually relatively low. In addition, the transducer elements are often isolated from each other by cutting slots, which provides additional thermal insulation for the transducer elements. In this way, the heat generated in the transducer element is enclosed in the acoustic stack and is difficult to radiat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01N29/24C09K5/14
Inventor 纪轩荣蓝咏
Owner 广州多浦乐电子科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap