Semiconductor light emitting diode component

Abstract

The invention discloses a semiconductor light emitting diode component, which comprises a first light emitting area, a second light emitting area, a third light emitting area, a first fluorescence conversion layer and a second fluorescence conversion layer, wherein the first fluorescence conversion layer and the second fluorescence conversion layer are respectively arranged on the first light emitting area and the second light emitting area; the fluorescence conversion layers can convert light rays which are emitted by the light emitting areas into the light rays with different wavelengths, so that the semiconductor light emitting diode component can generate multi-wavelength light rays; and the fluorescence conversion layers are directly formed on the surface of the semiconductor light emitting diode component, so that a mixed light effect is good, and an occupation space is small.

Description

Technical field [0001] The invention relates to a semiconductor light-emitting component, in particular to a light-emitting diode component capable of emitting multiple bands. Background technique [0002] The technology of solid state light emitting component (solid state light emitting component) is advancing day by day. More and more products use light emitting diode (LED) or laser diode (LD) as the light source, such as lighting (lighting) Or backlight unit (backlight unit). Compared with traditional light bulbs, solid-state light-emitting components are characterized by longer life span, lower energy consumption, lower heat generation, less infrared light spectrum generation, and smaller component sizes (compact). Since the light-emitting layer of the light-emitting diode component cannot form white light alone, the solid-state light-emitting component with a white light source is generally produced by a mixed light method, such as a blue light-emitting diode component with...

AI Technical Summary

Problems solved by technology

[0003] Although the package of blue light-emitting diode components with yellow phosphor can produce white light, its color rendering index (CRI) is insufficient, especially in the red spectral region.

In addition, although multi-chip packaging can produce white light with better color rendering, the light degradation levels of red, green and blue LED components are different, which may easily lead to a decrease in component yield.

In addition, in the multi-chip package, a specific distance is required between the LED component and the die for die bonding, resulting in a large footprint of the device. If the distance between the die and the die is too long, it will easily lead to uneven light mixing. Illumination such as uniformity and unwanted color zones

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