Plasma display panel and manufacturing method thereof

Abstract

The invention discloses a plasma display panel and a manufacturing method of a protective layer. The display panel comprises an upper substrate and a lower substrate, wherein the upper substrate and the lower substrate are sealed oppositely. A discharge electrode, a dielectric layer and a protective layer are successively arranged on the upper substrate; and the protective layer includes: a first protective layer, which is formed by magnesium oxide; and a second protective layer, which is covered on the first protective layer; besides, the second protective layer consists of alkaline earth oxide and silica / titanium dioxide. According to a technical scheme provided in the invention, a second protective layer is evaporated and plated on a magnesium oxide film layer, so that a few doping atoms are mixed in a crystal structure of the magnesium oxide; after the doping atoms replace atoms in the magnesium oxide, a diffusion coefficient of the crystal is increased, so that the diffusion coefficient of the crystal structure containing the doping atoms is greater than a self-diffusion coefficient of a crystal only having a single atom; and therefore, an electron motion speed is accelerated and the electronic number is increased; an emission coefficient of a secondary electron is increased; a working voltage of a plasma display panel (PDP) is reduced; and discharge delay time is further reduced.

Description

technical field

[0001] The invention relates to the field of plasma display screens, in particular to a plasma display screen and a manufacturing method. Background technique

[0002] Common AC gas discharge plasma display screens all adopt a surface discharge structure, which includes an upper substrate and a lower substrate sealed together with it. A transparent electrode ITO and a bus electrode are arranged on the upper substrate, and the transparent electrode and the bus electrode constitute a discharge electrode. The discharge electrode is further divided into a sustain discharge electrode X and a scan discharge electrode Y. The surface of the discharge electrode is covered with a dielectric layer, and the dielectric layer is covered with a protective layer. The protective layer is usually a magnesium oxide film. Addressing electrodes perpendicular to the discharge electrodes are arranged on the lower substrate, and a layer of dielectric layer is covered on the address...

Examples

Embodiment 1

[0040] Embodiment 1 technological step

[0041] The pre-order steps are the same as those of the prior art, and the process steps for forming the second protective layer: firstly, vacuum the chamber so that the degree of vacuum is 1.9×10 -4 Pa, the temperature was raised to 290°C while evacuating; after that, oxygen was passed into the chamber to reduce the vacuum to 2.8×10 -2 Pa, and then steam to reduce the vacuum to 5.1×10 -2 Pa; keep the moving speed of the substrate at 420 mm / sec during evaporation; finally control the thickness of the second protective layer to be 3700 angstroms.

Embodiment 2

[0042] Embodiment 2 technological steps

[0043] The steps are the same as in Example 1, the difference is: first vacuumize the chamber so that the degree of vacuum is 5.0×10 -4 Pa, the temperature was raised to 300°C while evacuating.

Embodiment 3

[0044] Embodiment 3 technological steps

[0045] The steps are the same as in Example 1, the difference is: first vacuumize the chamber so that the degree of vacuum is 7.6 × 10 -4 Pa, the temperature was raised to 310°C while evacuating.

technical field

[0001] The invention relates to the field of plasma display screens, in particular to a plasma display screen and a manufacturing method. Background technique

[0002] Common AC gas discharge plasma display screens all adopt a surface discharge structure, which includes an upper substrate and a lower substrate sealed together with it. A transparent electrode ITO and a bus electrode are arranged on the upper substrate, and the transparent electrode and the bus electrode constitute a discharge electrode. The discharge electrode is further divided into a sustain discharge electrode X and a scan discharge electrode Y. The surface of the discharge electrode is covered with a dielectric layer, and the dielectric layer is covered with a protective layer. The protective layer is usually a magnesium oxide film. Addressing electrodes perpendicular to the discharge electrodes are arranged on the lower substrate, and a layer of dielectric layer is covered on the address...

Examples

Embodiment 1

[0040] Embodiment 1 technological step

[0041] The pre-order steps are the same as those of the prior art, and the process steps for forming the second protective layer: firstly, vacuum the chamber so that the degree of vacuum is 1.9×10 -4 Pa, the temperature was raised to 290°C while evacuating; after that, oxygen was passed into the chamber to reduce the vacuum to 2.8×10 -2 Pa, and then steam to reduce the vacuum to 5.1×10 -2 Pa; keep the moving speed of the substrate at 420 mm / sec during evaporation; finally control the thickness of the second protective layer to be 3700 angstroms.

Embodiment 2

[0042] Embodiment 2 technological steps

[0043] The steps are the same as in Example 1, the difference is: first vacuumize the chamber so that the degree of vacuum is 5.0×10 -4 Pa, the temperature was raised to 300°C while evacuating.

Embodiment 3

[0044] Embodiment 3 technological steps

[0045] The steps are the same as in Example 1, the difference is: first vacuumize the chamber so that the degree of vacuum is 7.6 × 10 -4 Pa, the temperature was raised to 310°C while evacuating.

Images