High-performance viscosity-controllable silicon-based heat conducting paste and preparation method thereof

A heat-conducting paste, silicon-based technology, applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems that the viscosity of the heat-conducting silicone grease composition cannot be controlled at will, and the preparation method is complicated, so as to achieve improved stability, easy preparation, The effect of good thermal conductivity

Inactive Publication Date: 2012-03-21
TIANJIN LAIRD TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Chinese patent application publication CN101294067A discloses a thermally conductive silicone grease composition composed of organosilicon oil, silane coupling agent and thermally conductive powder. , and heat-treat the metal powder to form an oxide film on the surface

Method used

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  • High-performance viscosity-controllable silicon-based heat conducting paste and preparation method thereof
  • High-performance viscosity-controllable silicon-based heat conducting paste and preparation method thereof
  • High-performance viscosity-controllable silicon-based heat conducting paste and preparation method thereof

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preparation example Construction

[0022] The preparation method of the silicon-based thermal paste of the present invention is described below.

[0023] As mentioned above, the method for preparing silicon-based thermal paste in the present invention can be divided into: mixing a part by weight of matrix 11 and part by weight of viscosity modifier 13 in a reactor at a temperature of 0°C to 50°C, and mixing them at a lower speed Stir to make the matrix and the viscosity regulator mix evenly; then keep the temperature constant, add c parts by weight of the filled thermal conductive powder 12 to the reactor at one time or divide it into 2 to 5 equal parts or unequal parts, and at the same time Stir in a vacuum state, and adjust the stirring speed from a lower speed to a higher speed during each addition of the heat-conducting powder. After stirring until the mixture is uniform, adjust the stirring speed to a lower speed, and repeat The above operation of adding the filled thermal conductive powder is carried out ...

Embodiment 1～4

[0032] (1) Raw materials

[0033] Embodiments of the present invention have selected the following materials as raw materials, and weighed according to the weight ratio of raw materials:

[0034] ①Matrix:

[0035] Dimethicone (manufactured by Dow Corning, the brand is XIAMETER's simethicone), the viscosity is 50mm 2 / s and

[0036] Phenyl-modified polydimethylsiloxane (manufactured by Japan Shin-Etsu Corporation), viscosity is 1000mm 2 / s.

[0037] ②Fill with thermal powder:

[0038] Zinc oxide powder with an average particle size of 0.5 μm to 2 μm (activated zinc oxide manufactured by Changzhou Yuanchao Chemical Co., Ltd.),

[0039] Alumina powder, the average particle size is 3 μm~5 μm (manufactured by Aluminum Corporation of China),

[0040] Aluminum powder with an average particle size of 10 μm to 20 μm (manufactured by Henan Donghua Metal Powder Co., Ltd.).

[0041] ③Viscosity regulator:

Embodiment 1

[0042] Embodiment 1 has used silane coupling agent A151 (manufactured by U.S. Union Carbide Corporation),

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Abstract

The invention provides a high-performance silicon-based heat conducting paste, which comprises, by weight, 5%-20% of substrate, more than 1%-10% of viscosity modifier and the balance being heat conducting filler. By means of adding viscosity modifier, the designed controlling requirements on viscosity of heat conducting paste can be met, stability of the powdered heat conducting filler in a heat conducting paste system is improved, and the obtained heat conducting paste is excellent in performance.

Description

technical field [0001] The invention relates to a thermal interface organic heat-conducting material, in particular to a high-performance silicon-based heat-conducting paste with controllable viscosity. Background technique [0002] In the application of electronic components, if the problem of heat conduction of electronic components is not solved properly, it will directly affect the service life of the equipment, reduce the processing speed of signals, and increase the power dissipation of the equipment. With the increase of the functional integration scale of electronic equipment, the requirements for the heat dissipation capability of electronic components are also increasing. [0003] In order to solve the heat dissipation problem of the heat-generating electronic components, a heat sink is usually arranged above the electronic components to dissipate heat from the electronic components. However, due to the limitation of industrial production technology, the contact s...

Claims

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Application Information

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IPC IPC(8): C09K5/08C08L83/04C08K13/02C08K3/22C08K3/08
Inventor 万炜涛
Owner TIANJIN LAIRD TECH LTD
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