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Polishing solution for processing surfaces of copper and copper alloy by replacing copper pickling process

A polishing liquid and copper alloy technology, applied in the field of chemical polishing liquid, can solve the problems of unresolved stability of hydrogen peroxide, unstable brightness, difficult sewage treatment, etc., achieve batch and mechanized operations, and solve the quality of copper pickling. Instability, the effect of solving the stability problem of hydrogen peroxide

Inactive Publication Date: 2012-03-21
WENZHOU AOYANG METAL SURFACE TREATMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This pickling solution has the following disadvantages: 1. The brightness of mass production is not stable, so it is not suitable for mechanized operations; 2. It is prone to over-corrosion; 3. The loss of copper is large; There is great harm; 5. The sewage treatment is difficult and the discharge pollution is serious
In addition, when metal fittings such as copper zippers are chemically polished while they are attached to the cloth, the pigment used to dye the cloth will change color when it encounters nitric acid.
There is also the problem of the stability of hydrogen peroxide that has not been resolved.

Method used

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  • Polishing solution for processing surfaces of copper and copper alloy by replacing copper pickling process

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Experimental program
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Effect test

Embodiment 1

[0037] Embodiment 1. The chemical polishing solution is prepared by 10% hydrogen peroxide (hydrogen peroxide), 7% methanol, 0.8% concentrated sulfuric acid, OP-105% and about 78% purified water.

Embodiment 2

[0038] Embodiment 2. The chemical polishing liquid is prepared by 20% hydrogen peroxide (hydrogen peroxide), 6% ethanol, 1.0% concentrated sulfuric acid plus 4% and about 70% pure water.

Embodiment 3

[0039] Embodiment 3. The chemical polishing solution is prepared by 30% hydrogen peroxide (hydrogen peroxide), 5% ethylene glycol, 1.2% concentrated sulfuric acid, 3% polyethylene glycol and about 62% purified water.

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PUM

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Abstract

The invention relates to a polishing solution for processing surfaces of copper and copper alloy by replacing a copper pickling process. The polishing solution consists of the following components in percentage by volume: 10 to 40 percent of hydrogen peroxide, 2 to 5 percent of organic brightening agent, 0.8 to 2.4 percent of concentrated sulfuric acid, 3 to 8 percent of hydrogen peroxide stabilizing agent and the balance of water. The polishing solution does not comprise chromic acid, nitric acid or hydrochloric acid, smoothens the surface of the copper or the copper alloy through chemical polishing, and ensures complete luster on the surface subjected to chemical polishing.

Description

Technical field [0001] The present invention involves a chemical polishing solution for copper and copper alloy for chemical treatment. Background technique [0002] At present, the surface polishing solution of copper and copper alloys (hereinafter referred to as "copper, etc.) is generally used. Generally, liquids with chromic acid, nitric acid, and hydrochloric acid are used.The mechanism is chemically polished by the oxidation of chromic acid, nitric acid, and hydrochloric acid to the dissolving of copper for chromic acid, nitric acid, and hydrochloride.This kind of pickled liquid has the following shortcomings: 1. Batch production of light brightness is unstable and is not suitable for mechanized operations; 2. Evidence is prone to corrosion; 3. Copper losses are large; 4. produce a large amount of nitric oxide yellow smoke, to the human body to the human bodyThere are great damage; 5. The difficulty of sewage treatment is large and the discharge pollution is serious. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F3/06
Inventor 欧阳名化
Owner WENZHOU AOYANG METAL SURFACE TREATMENT
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