Polishing solution for replacing copper pickling process to teat copper and copper alloy surface

A technology of polishing liquid and copper alloy, which is applied in the field of metal surface treatment chemical polishing, can solve the problems of unstable brightness, over-corrosion, damage, etc., and achieve the solution of unstable copper pickling quality and the generation of nitrogen oxides The effect of labor efficiency

Inactive Publication Date: 2017-02-08
王薇
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This pickling solution has the following disadvantages: 1. The brightness of mass production is not stable, so it is not suitable for mechanized operations; 2. It is prone to over-corrosion; 3. The loss of copper is large; There is great harm; 5. The sewage treatment is difficult and the discharge pollut

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  • Polishing solution for replacing copper pickling process to teat copper and copper alloy surface

Examples

Experimental program
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Example Embodiment

[0014] Example 1

[0015] A polishing solution for treating copper and copper alloy surfaces instead of the copper pickling process. In terms of mass percentage, the polishing solution consists of the following components: potassium persulfate 5%, phytic acid 1%, potassium iodate 1%, The molecular weight is 2000 polyacrylamide 0.01%, oleic acid triethanolamine 0.5%, tetramethylammonium hydroxide 3%, surfactant coconut oil fatty acid diethanolamide 0.1%, complexing agent 0.1%, nonylphenol polyoxyethylene Ether is 0.5%, and the balance is deionized water; the complexing agent is tetrasodium hydroxyethylidene diphosphonate and a commercially available FA / O complexing agent in a weight ratio of 1:1.

Example Embodiment

[0016] Example 2

[0017] A polishing solution for treating copper and copper alloy surfaces instead of copper pickling process. The polishing solution is composed of the following components in terms of mass percentage: ammonium persulfate 10%, phytic acid 5%, potassium iodate 3%, The molecular weight is 10000 polyacrylamide 2%, oleic acid triethanolamine 2%, tetramethyl ammonium hydroxide 10%, surfactant coconut oil fatty acid diethanolamide 1%, complexing agent 3%, brightener plus 1%, The balance is deionized water; the complexing agent is tetrasodium hydroxyethylidene diphosphonate and a commercially available FA / O complexing agent in a weight ratio of 1:2.

Example Embodiment

[0018] Example 3

[0019] A polishing solution for treating copper and copper alloy surfaces instead of copper pickling process. In terms of mass percentage, the polishing solution is composed of the following components: sodium persulfate 8%, phytic acid 3%, potassium iodate 2%, The molecular weight is 5000 polyacrylamide 0.08%, oleic acid triethanolamine 1%, tetramethylammonium hydroxide 6%, surfactant coconut oil fatty acid diethanolamide 0.5%, complexing agent 1.5%, brightener aminoazole 0.7%, The balance is deionized water; the complexing agent is tetrasodium hydroxyethylidene diphosphonate and a commercially available FA / O complexing agent in a weight ratio of 1:1.2.

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Abstract

The invention provides a polishing solution for replacing a copper pickling process to teat copper and a copper alloy surface. The polishing solution consists of the following components in percentage by mass: 5-10% of persulfate, 1-5% of phytic acid, 1-3% of potassium iodate, 0.01-2% of polyacrylamide with molecular weight being 2000-10000, 0.5-2% of triethanolamine oleate, 3-10% of tetramethylammonium hydroxide, 0.1-1% of a surfactant, 0.1-3% of a complexing agent, 0.5-1% of a brightener and the balance deionized water. The polishing solution is a chemical polishing solution which does not contain sulfuric acid, chromic acid, nitric acid and hydrochloric acid, is used for smoothing copper and the copper alloy surface through chemical polishing, and giving sufficient gloss to the chemically polished surface. The polishing solution provided by the invention is suitable for large-batch mechanical production, and does not have an excessive corrosion phenomenon even after being used for repeatedly cleaning. Moreover, in a chemical polishing process, environmental pollution due to the fact that harmful nitric oxides and acid mists are generated by decomposing nitric acid is not caused, and chemical polishing can be safely carried out.

Description

technical field [0001] The invention belongs to the technical field of metal surface treatment chemical polishing, and in particular relates to a polishing solution for treating copper and copper alloy surfaces which replaces the copper pickling process. Background technique [0002] At present, the surface polishing liquid for processing copper and copper alloys (hereinafter referred to as "copper, etc.") generally uses a liquid mixed with chromic acid, nitric acid, or hydrochloric acid, and uses such a chemical polishing liquid to chemically polish copper, etc. The mechanism is chemical polishing through the oxidation of copper by chromic acid, nitric acid, and hydrochloric acid and the dissolution of copper by chromic acid, nitric acid, and hydrochloric acid. This pickling solution has the following disadvantages: 1. The brightness of mass production is not stable, so it is not suitable for mechanized operations; 2. It is prone to over-corrosion; 3. The loss of copper i...

Claims

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Application Information

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IPC IPC(8): C23F3/06
CPCC23F3/06
Inventor 王薇
Owner 王薇
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