Probe card and manufacture method

Abstract

The present invention discloses a rpobe card and a manufacture method, wherien the probe card comprises a carrier and a plurality of probes, the carrier is provided with an upper surface, the probes are configured on the carrier and arranged on the upper surface, each probe is provided with atleast serially connected first and second rod body portions, the first rod body portion is arranged on the upper surface and form a slant angle together with the upper surface, and between the extending directions of the first rod body portion and the second rod body portion there is provided an included angle.

Description

technical field [0001] The invention relates to a test element and its manufacturing method, and in particular to a probe card capable of maintaining relative positioning and flatness of probes and its manufacturing method. Background technique [0002] Electrical testing of an integrated circuit chip (IC chip) is very important in the manufacturing process. Each IC chip must be tested in wafer and package form to ensure its electrical function. When the integrated circuit is tested, the testing machine contacts the device under test (DUT) through a probe card, and transmits the electrical signal through the driving signal, and then analyzes the received electrical signal to obtain that the integrated circuit under test is a good product or The result of waste. [0003] When individual chips are tested in wafer form, the process is called wafer testing. The method of wafer detection is to make the test machine and the probe card form a test circuit, and directly contact t...

AI Technical Summary

Problems solved by technology

[0004] The probe card contains a plurality of precision probes, that is, the tip of each probe is fine-pitched (substantially less than 100 microns), and due to the influence of manufacturing process parameter variations, these probes are Under normal circumstances, the relative positioning and flatness will have too large deviation, which will cause poor contact or excessive indentation on the pad of the object under test, which will affect the reliability and accuracy of the test.

[0005] In addition, the distance between these probes of various existing probe cards cannot be reduced, so that electrical testing of fine-pitch contacts cannot be performed, and the types of chips that can be tested are limited.

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