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Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member

A circuit connection material and circuit technology, applied in conductive materials dispersed in non-conductive inorganic materials, printed circuit components, structural connection of printed circuits, etc., can solve problems such as short circuits, and ensure continuity and excellent connection. The effect of reliability

Active Publication Date: 2014-09-24
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using such a circuit connection material for high-density circuit connection, there is a problem that conductive particles are connected between adjacent circuits and a short circuit occurs

Method used

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  • Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
  • Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
  • Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0165]

[0166] [Production of conductive fine particles]

[0167] The scaly silver powder 1 having a particle size distribution of 0.005 to 10 μm was obtained by chemical reduction. The obtained silver powder 1 was classified to obtain a scaly silver powder 2 having an average particle diameter of 0.25 μm and a maximum particle diameter of 0.4 μm.

[0168] [Production of anisotropic conductive particles]

[0169] 60 parts by mass of tetramethylolmethane triacrylate, 20 parts by mass of divinylbenzene, and 20 parts by mass of acrylonitrile were mixed as raw material monomers of the organic insulating substance. Further, 120 parts by volume of silver powder 2 was added to 100 parts by volume of the raw material monomer of the organic insulating material, and the silver powder was dispersed for 48 hours using a bead mill. In the composition dispersed with this silver powder, mix 2 mass parts of benzoyl peroxide, and drop it into 850 mass parts of polyvinyl alcohol aqueous so...

manufacture example 2

[0170]

[0171] The silver powder 2 that makes in the manufacture example 1 is immersed in the solution that 3 mass parts N-(2-aminoethyl)-3-aminopropyltrimethoxysilane is dissolved in the solution in 100 mass parts methyl ethyl ketone, stirs 1 day and night, thereby Hydrophobizing the surface of silver powder. Except having used the silver powder whose surface was hydrophobized, it carried out similarly to the said manufacture example 1, and obtained the anisotropic electrically-conductive particle 2.

manufacture example 3

[0172]

[0173] The anisotropic conductive particles produced in Production Example 1 were classified to obtain anisotropic conductive particles 3 with an average particle diameter of 0.5 μm.

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Abstract

The circuit connecting material of the present invention is interposed between opposing circuit electrodes, and by applying pressure to the opposing circuit electrodes, the electrodes in the pressing direction are electrically connected, and it contains conductive materials dispersed in an organic insulating substance. Microparticles of anisotropic conductive particles.

Description

technical field [0001] The present invention relates to a circuit connection material, a film-like circuit connection material using the same, a circuit component connection structure, and a circuit component connection method. Background technique [0002] Adhesives have been used in the connection between liquid crystal display and TCP (Tape Carrier Package), the connection between FPC (Flexible Printed Circuit, flexible printed circuit) and TCP, and the connection between FPC and printed circuit board. An anisotropic conductive adhesive with conductive particles dispersed in it is used as a circuit connection material. And recently, when mounting a semiconductor silicon chip on a substrate, the conventional wire bonding method is not used, but the so-called flip-chip mounting of the semiconductor silicon chip face-down directly on the substrate is carried out. Anisotropic conductive adhesive (see Patent Documents 1 to 4). [0003] However, along with the miniaturization...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R11/01C09D5/25C09D133/00C09D179/08C09D183/04C09J9/02C09J11/04C09J11/06C09J163/00H01B1/00H01B1/22H01B1/24H05K1/14H05K3/32H05K3/36
CPCB82Y10/00H05K3/361H05K3/323Y10T29/532H05K2201/0323H05K2201/026H01L2224/83101H05K2201/0224Y10T29/49117H01L2924/12044H01L2924/00H01R11/01C09D5/00H05K1/14H05K3/32
Inventor 有福征宏小林宏治藤绳贡
Owner RESONAC CORP
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