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Aqueous cleaning low-temperature welding paste and preparation method thereof

A water cleaning and low temperature technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of long supply cycle, unguaranteed welding quality of electronic components, and restricted order quantity, and achieve fast welding speed. , Shorten the welding time, the effect of reasonable ratio

Active Publication Date: 2012-04-04
BEIJING INST OF NONFERROUS METALS & RARE EARTH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The solder paste used in the domestic electronic packaging and assembly industry mainly relies on imports, and it is rosin-halogen type. The delivery cycle is long, the order quantity is restricted, and the soldering quality of electronic components cannot be guaranteed.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Step 1: Solder Alloy Melting

[0036] According to the percentage by weight, 36%-44% of Pb, 18%-22% of Bi and the balance of Sn are respectively taken, and the total amount of each component is 100%, and the components are mixed and smelted to obtain an alloy;

[0037] Step 2: Solder Alloy Powder Preparation

[0038] Using the atomization method, using nitrogen as the atomizing gas, place the alloy prepared in step 1 at a pressure of 0.5MPa to 1.0MPa and a temperature of 380°C to 420°C to atomize the alloy powder, and the alloy Powder, through screening, to obtain solder alloy powder with a particle size of 25um to 50um;

[0039] Step 3: Flux Preparation

[0040] By weight percentage, take 6% malic acid, 4% hydroxyethyl cellulose, 20% dimethyl alkyl betaine, 5% hydrogenated castor oil, 55% glycerin, 10% sorbitol , the total amount of each component is 100%, add malic acid, hydroxyethyl cellulose, dimethyl alkyl betaine, hydrogenated castor oil, and sorbitol to glycer...

Embodiment 2

[0044] Step 1 and Step 2 are the same as in Example 1, except for the preparation of flux in step 3 and the preparation of solder paste in step 4.

[0045] By weight percentage, take 8% malic acid, 3% hydroxyethyl cellulose, 20% dimethyl alkyl betaine, 4% hydrogenated castor oil, 55% glycerin, 10% sorbitol , the total amount of each component is 100%. Add malic acid, hydroxyethyl cellulose, dimethyl alkyl betaine, hydrogenated castor oil, and sorbitol to glycerin, heat and stir, and mix well after being completely dissolved. Stand still to prepare soldering flux;

[0046] Step 4: Solder Paste Preparation

[0047] Take 88% of the solder alloy powder prepared in step 2 and 12% of the flux prepared in step 3 respectively in percentage by weight, and mix them evenly to obtain a water-cleaning low-temperature solder paste.

Embodiment 3

[0049] Step 1 and Step 2 are the same as in Example 1, except for the preparation of flux in step 3 and the preparation of solder paste in step 4.

[0050] Step 3: Flux Preparation

[0051] By weight percentage, take 7% malic acid, 6% hydroxyethyl cellulose, 20% dimethyl alkyl betaine, 4% hydrogenated castor oil, 55% glycerin, 8% sorbitol , the total amount of each component is 100%. Add malic acid, hydroxyethyl cellulose, dimethyl alkyl betaine, hydrogenated castor oil, and sorbitol to glycerin, heat and stir, and mix well after being completely dissolved. Stand still to prepare soldering flux;

[0052] Step 4: Solder Paste Preparation

[0053] Take 87% of the solder alloy powder prepared in step 2 and 13% of the flux prepared in step 3 respectively in percentage by weight, and mix them evenly to obtain a water-cleaning low-temperature solder paste.

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PUM

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Abstract

The invention discloses aqueous cleaning low-temperature welding paste and a preparation method thereof. The welding paste comprises the following components in percentage by weight: 85 to 90 percent of soldering alloy powder, and 10 to 15 percent of scaling powder, wherein the soldering alloy powder consists of the following components in percentage by weight: 36 to 44 percent of Pb, 18 to 22 percent of Bi and the balance of Sn; and the scaling powder is formed by mixing 2 to 10 weight percent of active agent, 1 to 10 weight percent of pasting agent, 20 to 30 weight percent of wetting agent, 2 to 10 weight percent of thixotropic agent, and 50 to 70 weight percent of solvent and the total percentage of all components is 100 percent. The welding paste is suitable for various welding processes, is high in welding speed, does not damage components, does not contain halogen and does not have corrosiveness, and residues are few after welding.

Description

technical field [0001] The invention belongs to the technical field of electronics and chemical industry, and in particular relates to a water-cleaning low-temperature solder paste and a preparation method thereof. Background technique [0002] The solder paste required for electronic components and assembly processes is mostly rosin-halogen type. After the soldering is completed, it needs to be cleaned with a special cleaning agent—chlorofluorocarbon solvent. If the cleaning is not clean, the electronic components will be damaged. Corrosion of devices and circuits, welding quality is difficult to guarantee, and it will also pollute the environment. Since the 1980s, foreign advanced industrial countries began to develop water-cleaning solder paste for the welding of high-reliability electronic components to meet commercial and military purposes. The solder paste used in the domestic electronic packaging and assembly industry mainly relies on imports, and is rosin-halogen ty...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/26B23K35/363
Inventor 李刚
Owner BEIJING INST OF NONFERROUS METALS & RARE EARTH
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