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Coated conductive particles and method for producing same

A technology of conductive particles and manufacturing methods, which can be used in printed circuit manufacturing, cable/conductor manufacturing, conductive connection, etc., can solve problems such as rising connection resistance and poor connection between electrodes of opposite circuits, and achieve excellent moisture absorption resistance and coating The rate deviation is small and the effect of avoiding agglutination

Inactive Publication Date: 2012-05-23
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, if conductive particles flow out between adjacent circuit electrodes, the number of conductive particles replenished between the gold bump and the glass panel decreases, resulting in an increase in connection resistance between opposing circuit electrodes, resulting in poor connection. question

Method used

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  • Coated conductive particles and method for producing same
  • Coated conductive particles and method for producing same
  • Coated conductive particles and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101] (1) Preparation of composite conductive particles

[0102] 100 g of resin particles (crosslinked polystyrene particles) with an average particle diameter of 3.8 μm were added to 100 mL of Atotech Neoganth 834 (Atotech Japan Co., Ltd., trade name) containing 8% by mass as a palladium catalyst. palladium catalyst solution and stirred at 30°C for 30 minutes. Then, it was filtered with a φ3 μm membrane filter (manufactured by Milipore Co., Ltd.), and washed with water. The water-washed resin particles were added to a 0.5% by mass dimethylamine borane solution adjusted to pH 6.0 to obtain surface-activated resin particles.

[0103] Next, the surface-activated resin particles were dispersed in 200 mL of 0.2% ammonia solution, and heated to 65°C. Then, the electroless plating solution (dropping solution A and dropping solution B) shown in Example 1 of Table 1 was added dropwise thereto at a dropping rate of 50 mL / min with each dropping solution to form thick coating. The ...

Embodiment 2

[0116] Except using the electroless plating solution shown in Example 2 of Table 1, in the same manner as in Example 1, a Composite conductive particles 2 with thickness nickel-palladium alloy coating. The appearance of the particles after plating was good. Next, according to the same procedure as in Example 1, the silica particles were attached to the composite conductive particles 2 to manufacture the coated conductive particles 2 coated with the silica particles, and an anisotropic conductive adhesive film was further formed. Fabrication and circuit connection using the adhesive film.

Embodiment 3

[0118] Except using the electroless plating solution shown in Example 3 of Table 1, in the same manner as in Example 1, a Composite conductive particles 3 thick nickel-palladium alloy plating. Although the appearance of the particles after plating was generally good, partial peeling occurred. Next, according to the same procedure as in Example 1, the silica particles were attached to the composite conductive particles 3 to manufacture the coated conductive particles 3 coated with the silica particles, and an anisotropic conductive adhesive film was further formed. Fabrication and circuit connection using the adhesive film.

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Abstract

To provide conductive particles which are capable of providing an anisotropically conductive adhesive that can maintain sufficient insulation characteristics and conduction characteristics even when used for the connection of a very small circuit, while having excellent moisture absorption resistance at a lower cost. A coated conductive particle (5) comprises: a composite conductive particle (3) that has a resin particle (4) and a metal layer (6) that covers the resin particle (4); and insulating fine particles (1) that are provided on the outer side of the metal layer (6) so as to partially cover the surface of the metal layer (6). The metal layer (6) has a nickel-palladium alloy plating layer (6a).

Description

technical field [0001] The invention relates to a coated conductive particle and a manufacturing method thereof. Background technique [0002] The methods of mounting liquid crystal driving ICs on glass panels for liquid crystal displays can be roughly divided into two types: COG (Chip-on-Glass) mounting and COF (Chip-on-Flex) mounting. In COG mounting, ICs for liquid crystals are directly bonded to glass panels using anisotropic conductive adhesives containing conductive particles. On the other hand, in COF mounting, ICs for driving liquid crystals are bonded on flexible tapes with metal wiring, and they are bonded to glass panels using an anisotropic conductive adhesive containing conductive particles. The term "anisotropy" here means conduction in the pressurized direction and insulation in the non-pressurized direction. [0003] However, in recent years, along with the high-definition of liquid crystal displays, the pitch and area of ​​gold bumps used as IC circuit ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R11/01H01B5/00H01B13/00B22F1/102B22F1/18
CPCH05K2201/0338H05K2201/0224B22F1/0062B22F2998/10H05K2201/0221H05K3/323B22F1/025B22F1/00B22F1/102B22F1/18H01R11/01H01B5/00H01B13/00
Inventor 高井健次江尻芳则永原忧子松泽光晴
Owner RESONAC CORPORATION
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