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Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof

An underfill and rapid curing technology, which is applied in semiconductor/solid-state device components, electric solid-state devices, electrical components, etc., can solve the problems of late start of epoxy packaging materials, difficulty in adapting to quality and performance, influence and restriction, etc. Achieve the effect of meeting urgent needs, promoting development, and having a long storage period

Active Publication Date: 2014-01-01
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In recent years, my country's electronic information industry has developed rapidly, but epoxy packaging materials started relatively late and there are relatively few studies, especially for liquid epoxy underfill materials for flip chips. The quality and performance of existing technology products are difficult to adapt to and Meeting the needs of applications will inevitably have a great impact and restriction on the development of the industry

Method used

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  • Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof
  • Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof
  • Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1. The epoxy underfill adhesive that can be cured quickly at low temperature in this embodiment is composed of raw materials in parts by weight:

[0026]

[0027]

[0028] 2. The preparation method of epoxy underfill in this embodiment is as follows:

[0029] (a) bisphenol A type epoxy-modified polyurethane, bisphenol F epoxy resin and carbon black are mixed homogeneously; Then add silicon micropowder and mix homogeneously;

[0030] (b) After adding the curing agent and mixing evenly in the reaction kettle, the vacuum degree is -0.1Mpa, and the vacuum is pumped for 30min;

[0031] (c) Add A-187, polypropylene glycol diglycidyl ether, ion adsorbent, and polyethylene oxide alkyl ether and mix evenly. The vacuum degree is -0.1Mpa, and the vacuum is pumped for 30 minutes to obtain the product.

Embodiment 2

[0033] 1. The epoxy underfill adhesive that can be cured quickly at low temperature in this embodiment is composed of raw materials in parts by weight:

[0034]

[0035] 2. The preparation method of epoxy underfill in this embodiment is as follows:

[0036] (a) bisphenol A type epoxy-modified polyurethane, bisphenol F epoxy resin and carbon black are mixed homogeneously; Then add silicon micropowder and mix homogeneously;

[0037] (b) After adding the curing agent and mixing evenly in the reaction kettle, the vacuum degree is -0.1Mpa, and the vacuum is pumped for 60min;

[0038] (c) Add KBM-403, diglycidyl ether, ion adsorbent, and sorbitan fatty acid ester and mix evenly. The vacuum degree is -0.1Mpa, and the vacuum is pumped for 60 minutes to obtain the product.

Embodiment 3

[0040] 1. The epoxy underfill adhesive that can be cured quickly at low temperature in this embodiment is composed of raw materials in parts by weight:

[0041]

[0042]

[0043] Wherein, the surfactant is a combination of polyethylene oxide alkyl ether: sorbitan fatty acid ester=1:1 by weight.

[0044] 2. The preparation method of epoxy underfill in this embodiment is as follows:

[0045] (a) bisphenol A type epoxy-modified polyurethane, bisphenol F epoxy resin and carbon black are mixed homogeneously; Then add silicon micropowder and mix homogeneously;

[0046] (b) After adding the curing agent and mixing evenly in the reaction kettle, the vacuum degree is -0.1Mpa, and the vacuum is pumped for 50min;

[0047] (c) Add KH-560, adipate glycidyl ether, ion adsorbent, and surfactant and mix evenly. The vacuum degree is -0.1Mpa, and the vacuum is pumped for 50 minutes to obtain the product.

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Abstract

The invention discloses an epoxy under-fill adhesive capable of quickly curing at a low temperature. The components are as follows in part by weight: 16 to 53 parts of bisphenol A epoxy modified polyurethane, 17 to 50 parts of bisphenol F epoxy resin, 5 to 30 parts of toughener, 2 to 9 parts of curing agent, 2 to 8 parts of silane coupling agent, 1 to 7 parts of carbon black, 1 to 3 parts of ion adsorbent, 1 to 3 parts of surfactant, and 0 to 14 parts of silica micro powder. The invention further discloses a preparation method for the epoxy under-fill adhesive. The product is liquid single-component epoxy under-fill adhesive with the excellent performances such as small viscosity, easy flowing filling, quick low-temperature curing, good stability, a long storage period and the like; moreover, the preparation operation is simple, so that the epoxy under-fill adhesive is suitable for a large-scale industrial production, thus the imperious demands for a flip-chip technology are well satisfied with the benefit of prompting and pushing the development of the electronic information industry.

Description

technical field [0001] The invention relates to the technical field of electronic device chip packaging, in particular to a liquid one-component epoxy bottom filling glue and a preparation method thereof. Background technique [0002] With the continuous improvement of the integration of electronic devices, the chip area continues to expand, and the number of integrated circuit pins also continues to increase, so the chip package size needs to be further miniaturized. In order to adapt to this development trend, many new packaging technologies have emerged, and flip chip is one of the most important packaging technologies. The so-called flip-chip technology refers to face down the chip, so that the conductive bumps are directly connected to the substrate wiring layer circuit as the chip electrode, and are firmly connected by soldering, thus avoiding redundant packaging processes, with small size and high reliability. The advantages of high-frequency operation, low parasitic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08L75/04C08K13/02C08K5/54C08K3/04C08K3/02C08G59/40C08G59/20H01L23/29
Inventor 冯朝波侯甫文徐耀华许京丽
Owner GUANGZHOU BAIYUN CHEM IND
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