Double curing encapsulating adhesive and preparation method thereof

An encapsulation, dual-curing technology, used in chemical instruments and methods, adhesives, epoxy resins, etc., can solve the problems of encapsulation cannot be quickly positioned and curing is incomplete, and achieve water resistance and resistance to cold and heat cycles. The effect of superior performance, low shrinkage and excellent mechanical properties

Inactive Publication Date: 2012-06-20
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a dual-cure encapsulant and a preparation method thereof for the encapsulants currently on the market that cannot be positioned quickly and are incompletely cured.

Method used

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  • Double curing encapsulating adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Accurately weigh the following raw materials, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate 55g, 1,4-butanediol 2.5g, β-(3,4-cyclo Oxycyclohexyl) ethyltrimethoxysilane 5g drops into reactor, and rotating speed 800 rev / mins, mixes 15 minutes at room temperature, then takes by weighing photoinitiator and is the IHT-PT445 0.3g of Beijing Yingli Science and Technology Development Co., Ltd., Acid anhydride thermal initiator 0.2g, put it into the reaction kettle under the condition of avoiding light, rotate at 800 rpm, mix it at room temperature for 15 minutes, make it into a homogeneous solution, then weigh 37g of silicon micropowder, and add it to the reaction in three equal batches In the kettle, at a temperature of 20°C, a vacuum degree of -0.07MPa, and a rotation speed of 800 rpm, stir and mix for 2 hours to obtain the product.

Embodiment 2

[0024] Accurately weigh the following raw materials, bis(7-oxabicyclo[4.1.0]3-heptylmethyl)adipate 47g, 1,4-butanediol 2g, γ-glycidyloxypropyltrimethyl Put 5g of oxysilane into the reaction kettle at a speed of 1000 rpm, mix at room temperature for 20 minutes, then weigh the photoinitiator as 0.5g of IHT-PT432 from Beijing Yingli Technology Development Co., Ltd., and 0.5g of the amine thermal initiator , put it into the reaction kettle under the condition of avoiding light, the speed is 1000 rpm, mix at room temperature for 20 minutes to make it into a homogeneous solution, then weigh 45g of silicon micropowder, add it into the reaction kettle in three batches, and put it at a temperature of 20°C , vacuum degree -0.05MPa, rotating speed 1000 rpm, stirring and mixing for 2 hours to obtain the product.

Embodiment 3

[0026] Accurately weigh the following raw materials, bis(7-oxabicyclo[4.1.0]3-heptylmethyl)adipate 20g, bisphenol A type epoxy resin (E51) 15g, 1,4-butanedi Put 5 g of alcohol and 4 g of γ-mercaptopropyltrimethoxysilane into the reaction kettle at a speed of 1000 rpm, mix at room temperature for 25 minutes, then weigh the photoinitiator as IHT-PT436 0.5 g, 0.5g of onium salt thermal initiator, put into the reaction kettle under the condition of avoiding light, the rotating speed is 1000 rpm, mix at room temperature for 20 minutes, make it into a homogeneous solution, then weigh 45g of silicon micropowder, 10g of quartz powder, Add three batches of equal amounts into the reaction kettle, and stir and mix for 2 hours at a temperature of 20°C, a vacuum degree of -0.05MPa, and a rotation speed of 1000 rpm to obtain the product.

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Abstract

The invention relates to a double curing encapsulating adhesive and a preparation method thereof. The double curing encapsulating adhesive comprises the following raw materials in percentage by weight: 35 to 60 percent of epoxy resin, 2 to 20 percent of polyol, 1 to 20 percent of silane coupling agent, 0.1 to 2 percent of photoinitiator, 0.1 to 2 percent of thermal initiator and 30 to 60 percent of filler. The double curing encapsulating adhesive provided by the invention with low contraction rate and high water resistance and cold and heat circulation resistance can effectively guarantee that encapsulated elements are reliable; the adhesive can cure quickly and completely under ultraviolet (UV) and heat while delivering quick positioning and excellent mechanical properties; with light smell after curing, the adhesive is environment-friendly; and with high storage stability, the adhesive is suitable to adhere electronic elements.

Description

technical field [0001] The invention relates to an encapsulant and a preparation method thereof, in particular to a dual-cure encapsulant and a preparation method thereof. Background technique [0002] At present, the packaging industry is still developing vigorously, and advanced packaging technologies such as BGA (Ball Grid Array), Flip Chip, and CSP (Chip Scale Package) have become mainstream. The development of packaging technology has increasingly stringent requirements on the characteristics of packaging materials, which also drives the development of the packaging material market. [0003] Packaging material is one of the most important materials and occupies an important position in this field. Its main function is to protect wafers and circuits from being affected and damaged by the external environment, so as to prolong the reliability of products. Among them, encapsulation glue is an important packaging material. [0004] At present, most of the encapsulants on ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04C09K3/10
Inventor 王红娟王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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