Novel MEMS (microelectromechanical systems) bionic acoustic vector sensor and manufacturing method thereof

An acoustic vector sensor and processing method technology, applied in the field of acoustics, can solve problems such as difficult processing, high operating frequency, and large underwater propagation loss, and achieve improved structural accuracy and yield, optimized processing technology, and controllable gap depth Effect

Inactive Publication Date: 2012-06-20
NORTHWESTERN POLYTECHNICAL UNIV
View PDF0 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Shivok of the University of California et al processed a vector sensor with a sensitive frequency of 3.5KHz by layer-by-layer deposition, but due to the high operating frequency and large underwater propagation loss, it is not conducive to monitoring low-frequency ship noise (Shivok, T.J.Mems Polymumps-Based Mini-ature Microphone for Directional Sound Sensing, Master's Thesis, Monterey, CA: Naval Postgraduate.School.2

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Novel MEMS (microelectromechanical systems) bionic acoustic vector sensor and manufacturing method thereof
  • Novel MEMS (microelectromechanical systems) bionic acoustic vector sensor and manufacturing method thereof
  • Novel MEMS (microelectromechanical systems) bionic acoustic vector sensor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The novel MEMS bionic acoustic vector sensor in this embodiment includes a silicon structure layer and a glass structure layer;

[0026] refer to figure 1 , the silicon structure layer includes a left vibrating diaphragm 1, a right vibrating diaphragm 2, a horizontal beam 3, and a vertical beam 4; the left vibrating diaphragm 1 and the right vibrating diaphragm 2 are both square, and both pass through The horizontal beam 3 is connected; the vertical beam 4 forming a cross connection with the horizontal beam 3 is connected to the anchor point area through two end points, and the left vibrating diaphragm 1, the right vibrating diaphragm 2 and the horizontal beam 3 are connected to the surrounding The anchor points are separated by slits 8, so that the left vibrating diaphragm 1, the right vibrating diaphragm 2 and the horizontal beam 3 together form a suspension structure; in order to avoid the disturbance of the square diaphragm during the vibration process and make it d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a novel MEMS bionic acoustic vector sensor structure, which belongs to the field of acoustics. Moveable comb teeth 6 are arranged on a left vibrating diaphragm 1 and a right vibrating diaphragm 2 of the novel MEMS bionic acoustic vector sensor structure, and form comb tooth pairs with fixed comb teeth 7 which are connected in an anchoring area 9. By adopting a comb tooth pair structure, the defect that the conventional structure cannot detect capacitance due to existence of reinforcing ribs is remedied, so that a vibrating amplitude curve can be detected by detecting the capacitance change, the amplitudes and damping of a first-order modal frequency and a second-order modal frequency can be sequentially computed, an acoustic pressure value is tested by a testing microphone beside an apparatus, and an incidence angle of sound wave is computed for positioning an acoustic source. The invention also discloses a manufacturing method for the novel MEMS bionic acoustic vector sensor structure. When an SOG technology is used for etching a fluid clearance on glass, the technology is simple and the clearance depth is controllable, so that a footing effect generated in the deeply etching process in an ICP technology is avoided, the manufacturing technology is optimized, and the structural precision and the yield rate of apparatus are improved.

Description

Technical field: [0001] The invention relates to a novel MEMS bionic sound vector sensor structure, which belongs to the field of acoustics. Background technique: [0002] Acoustic detection and positioning technology has important applications in the monitoring fields of ocean, low-altitude and ground moving targets. The small and unique auditory organ of parasitic flies shows surprising positioning ability. It uses the mechanical coupling effect of the bridge between the eardrums between the two ears to amplify the time difference (phase difference) between the sound waves reaching the left and right eardrums, and the nervous system can distinguish The different phase differences generated at different incident angles are used to localize the sound source. [0003] At present, many researchers at home and abroad have developed vector sensors for sound source localization according to the physiological characteristics of parasitic flies. Shivok of the University of Califo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01S5/22G01H11/06B81B3/00B81C1/00
Inventor 苑伟政刘振亚任森邓进军庄成乾
Owner NORTHWESTERN POLYTECHNICAL UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products