Paste welding combination and preparation method and application thereof
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A composition and paste technology, applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of poor solderability, non-wetting, etc.
Active Publication Date: 2012-06-27
厦门市及时雨焊料有限公司
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Problems solved by technology
These metal devices tend to show poor solderability due to material characteristics, exposure storage, etc.
If the traditional printed circuit board solder paste is directly used for rapid heating and welding of the above metal products, it is easy to show partial non-wetting or complete non-wetting
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Embodiment 1
[0030] The present invention is described in detail below with the aid of examples and comparative examples, and the significant effect achieved by the present invention is illustrated through the inspection tests of the examples and comparative examples. See Table 1 for the composition and weight percentage of the paste soldering composition. The mode of carrying out the present invention is not limited to the embodiment, but merely illustrated.
[0031] Table 1 Components and content ratio of paste soldering composition
[0032]
[0033] The total amount of the above paste soldering composition is 100 g, and the unit of content of each component is g.
[0034] Embodiment 1 Preparation process:
[0035] Add white petrolatum, sliced paraffin, hydrocarbon solvent, and trimethylolpropane oleic acid dimer into the beaker in proportion, heat until clear, then slowly stir and cool. Weigh in diethylhydroxylamine salt of hydroxyethylidene diphosphonate and 1,2,3-benzotriazole,...
Embodiment 2
[0060] Weigh and mix raw materials (grams) according to the following proportions,
[0061] Prepare 100g of paste soldering composition, prepared according to the following composition and content (g) ratio:
[0065] According to the preparation process of Example 1, a paste soldering composition and a solder paste with better comprehensive...
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Abstract
The invention provides a paste welding combination and a preparation method and application thereof. The paste welding combination contains the following components according to percentage by weight: 10-14% of white Vaseline, 5-20% of sliced paraffin, 5-30% of trimethylolpropane oleic acid dimeric esters, 5-40% of hydrocarbon solvent, 2-20% of salt activator and 0.05-5% of corrosion inhibitor. The salt activator is the salt formed through neutralization reaction of organic phosphoric acid and diethyl hydroxylamine. The preparation method of the paste welding combination includes the following steps: preparing white Vaseline, sliced paraffin and trimethylolpropane oleic acid dimeric esters in proportion, heating to be clear solution, then cooling to paste, mixing the paste with the salt activator and the corrosion inhibitor, grinding and obtaining the paste welding combination. The combination and tin-based soft solder alloy powder can be combined to be further made into soldering paste. The paste welding combination has the advantages of being strong in weld-aid activity, long in storage period and capable of being spread on a point. The preparation method and application thereof are suitable for rapid heating welding of a plurality of metal materials.
Description
technical field [0001] The invention belongs to the field of industrial soldering, and in particular relates to a paste soldering composition and its preparation method and application. The paste soldering composition can be used to further make solder paste. Background technique [0002] Solder paste is the solder used in reflow soldering of electronic printed circuit boards. Solder paste is made by mixing ultra-fine tin-based spherical solder powder (20-75μm) and paste solder composition (flux paste). Soldering pastes usually contain resins, thixotropes, solvents, activators, corrosion inhibitors and other additives. The solder paste has two functions in the solder paste: one is to help soldering, that is, to remove metal oxides when heated, and an activator needs to be added to the solder paste; the other is to serve as a carrier of solder powder, and the solder paste needs to be added with resin, Solvent, thixotropic agent, etc. are formulated into a suitable paste. ...
Claims
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Application Information
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