Common Tg lead-free copper clad laminate and preparation method thereof

A copper clad laminate and common technology are applied in the field of common Tg lead-free epoxy glass cloth-based copper clad laminate and its preparation, which can solve the problems of inability to reduce the cost of raw materials, and achieve good machinability, low water absorption, low cost effect

Active Publication Date: 2012-06-27
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, glass fiber cloth and copper foil mainly rely on upstream raw material manufacturers, and there are not many alternative materials, so the cost of these raw materials cannot be reduced

Method used

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  • Common Tg lead-free copper clad laminate and preparation method thereof
  • Common Tg lead-free copper clad laminate and preparation method thereof
  • Common Tg lead-free copper clad laminate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] 1. Proportion of glue mixing formula (by weight):

[0048] Formula formula ratio (mass ratio)

[0049] Brominated modified epoxy resin 47.912%,

[0050] Phenolic curing agent 15%,

[0051] Dimethylimidazole 0.008%,

[0052] Microsilica 10%,

[0053] Aluminum hydroxide 4%,

[0054] Silane 0.08%,

[0055] Propylene Glycol Methyl Ether 23%.

[0056] 2. Preparation process:

[0057] 1> Glue adjustment:

[0058] A. Add propylene glycol methyl ether and silane sequentially into the mixing tank according to the formula amount, turn on the high-speed stirrer, control the speed at 1500 rpm, keep stirring continuously and control the tank temperature at 45°C, then add silicon micropowder and aluminum hydroxide, Continue stirring for 60 minutes after adding;

[0059]B. Add brominated modified epoxy resin and phenolic curing agent in sequence according to the formula in the stirring tank, stir for 40 minutes at a speed of 1500 rpm, and simultaneously start the cooling wate...

Embodiment 2

[0084] 1. Proportion of glue mixing formula (by weight):

[0085] Formula formula ratio (mass ratio)

[0086] Brominated modified epoxy resin 40.923%,

[0087] Phenolic curing agent 12%,

[0088] Dimethylimidazole 0.007%,

[0089] Microsilica 13%,

[0090] Aluminum hydroxide 6%,

[0091] Silane 0.07%,

[0092] Propylene Glycol Methyl Ether 28%.

[0093]

[0094] 2. Preparation process:

[0095] 1> Glue adjustment:

[0096] A. Add propylene glycol methyl ether and silane sequentially into the mixing tank according to the formula amount, turn on the high-speed stirrer, control the speed at 1500 rpm, keep stirring continuously and control the tank temperature at 45°C, then add silicon micropowder and aluminum hydroxide, Continue stirring for 60 minutes after adding;

[0097] B. Add brominated modified epoxy resin and phenolic curing agent in sequence according to the formula in the stirring tank, stir for 40 minutes at a speed of 1500 rpm, and simultaneously start the...

Embodiment 3

[0121] 1. Proportion of glue mixing formula (by weight):

[0122] Formula formula ratio (mass ratio)

[0123] Brominated modified epoxy resin 50.93%;

[0124] Phenolic curing agent 18%;

[0125] Dimethylimidazole 0.010%;

[0126] Silica powder 10%;

[0127] Aluminum hydroxide 3%;

[0128] Silane 0.06%;

[0129] Propylene Glycol Methyl Ether 18%.

[0130] 2. Preparation process:

[0131] 1> Glue adjustment:

[0132] A. Add propylene glycol methyl ether and silane sequentially into the mixing tank according to the formula amount, turn on the high-speed stirrer, control the speed at 1500 rpm, keep stirring continuously and control the tank temperature at 45°C, then add silicon micropowder and aluminum hydroxide, Continue stirring for 60 minutes after adding;

[0133] B. Add brominated modified epoxy resin and phenolic curing agent in sequence according to the formula amount in the stirring tank, stir at a speed of 1500 rpm for 40 minutes, and at the same time turn on the...

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Abstract

The invention discloses a common Tg lead-free copper clad laminate and a preparation method thereof. In the method, an adhesive which is prepared from multi-functional epoxy resin, a curing agent and auxiliary materials in a proper proportion is coated and cemented on a glass fiber cloth, and copper foil is coated on the glass fiber cloth and subjected to hot pressing, thus obtaining the common Tg lead-free copper clad laminate. The preparation method of the copper clad laminate comprises the following steps: preparing the adhesive; cementing to prepare a semi-cured plate; and typesetting and pressing. The common Tg lead-free copper clad laminate prepared by the invention has the advantages of stable size, low water absorption rate, excellent machinability, excellent heat resistance, CAF (conductive anodic filament) resistance, electrical resistance and combustion resistance and low cost, and is completely suitable for production of a high-stage high-density interconnected laminate.

Description

technical field [0001] The invention belongs to the field of preparation of copper-clad boards, and in particular relates to a common Tg lead-free epoxy glass cloth-based copper-clad board and a preparation method thereof. Background technique [0002] Due to the rapid development of the current electronic industry, electronic products are required to develop in the direction of light weight, thinner, high performance, high reliability and environmental protection, so higher requirements are put forward for printed circuit boards and copper clad boards. The specific requirements of its products are high heat resistance, low thermal expansion coefficient, high humidity and heat resistance, environmental protection and flame retardancy, etc. [0003] With the gradual enhancement of human environmental awareness, the use of heavy metals is gradually controlled and prohibited. On February 13, 2003, the European Union's "Waste Electrical and Electronic Products Directive (WEEE)"...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/092B32B15/14B32B27/04C08L63/00C08K13/06C08K9/06C08K3/02C08K3/22C08G59/62H05K1/02H05K3/00
Inventor 刁兆银况小军席奎东
Owner NANYA NEW MATERIAL TECH CO LTD
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