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High adhesiveness silicone gel for embedding precision electron component

A precision electronics and high-adhesion technology, applied in adhesives, chemical instruments and methods, and other chemical processes, can solve problems such as poor adhesion of substrates, aging of additives, etc.

Inactive Publication Date: 2012-06-27
TANGSHAN SANYOU SILICON IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of use, silicone gel has the problem of unsatisfactory adhesion to many substrates. In order to improve this deficiency, the patent [Japanese Patent Laid-Open No. 62-290754] discloses the use of additive hexamethyldisilica Azane, the patent [Japanese Patent Application No. 63-165455] discloses the use of silyl ketene acetal, and the patent [EP0471475A2] discloses the use of organic compounds in which 5 to 30 mol% of the molecular end groups are trivinyl silyl groups. polysiloxanes, but the use of these additives brings different problems, including aging of the additives through hydrolysis during storage of the composition, and volatilization of the additives during heat curing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Accurately weigh 100g of vinyl-terminated silicone oil with a viscosity of 10000mPa·s, 0.8g of platinum vinyl siloxane chelate with a concentration of 5000ppm, and 60g of dimethyl silicone oil with a viscosity of 25mPa.S, and mix them uniformly to obtain component A , packed for use;

[0024] Accurately weigh 100g of vinyl-terminated silicone oil with a viscosity of 10,000mPa·s, 8g of hydrogen-containing silicone oil, and 52g of dimethyl silicone oil with a viscosity of 20mPa.S, add 0.0550g of ethynyl cyclohexanol, and mix uniformly to obtain component B. Packaged for use; the hydrogen-containing silicone oil is a mixture of 0.52% and 0.21% hydrogen.

[0025] When in use, mix the prepared component A and component B uniformly at a weight ratio of 1:1, cure at room temperature for 8 hours, and cure at 80°C for 30 minutes.

Embodiment 2

[0027] Accurately weigh 100g of vinyl-terminated silicone oil with a viscosity of 5000mPa·s, 0.5g of alcohol-modified chelate of chloroplatinic acid with a concentration of 5000ppm, and 40g of dimethyl silicone oil with a viscosity of 50mPa.S, and mix them uniformly to obtain group A points, packaged for use;

[0028] Accurately weigh 100 g of vinyl-terminated silicone oil with a viscosity of 5000 mPa s, 12 g of hydrogen-containing silicone oil with a viscosity of 55 mPa s, 28 g of dimethyl silicone oil with a viscosity of 20 mPa. 1g of oxypolysiloxane, uniformly mixed to obtain component B, packaged for use; wherein the hydrogen-containing silicone oil is a mixture of hydrogen-containing silicone oil with a hydrogen content of 0.57% and 0.15% with Si-H bonds on both ends.

[0029] When in use, mix the prepared component A and component B uniformly at a weight ratio of 1:1, cure at room temperature for 8 hours, and cure at 80°C for 30 minutes.

Embodiment 3

[0031] Accurately weigh 100g of vinyl silicone oil with a viscosity of 3000mPa·s, 0.3g of platinum vinyl siloxane chelate with a concentration of 5000ppm, 20g of dimethyl silicone oil with a viscosity of 80mPa.S, add 0.2g of MQ resin, and mix evenly After obtaining component A, it is packaged for use;

[0032] Accurately weigh 100g of vinyl silicone oil with a viscosity of 3000mPa·s, 10g of hydrogen-containing silicone oil with a hydrogen content of 0.25%, 12g of dimethyl silicone oil with a viscosity of 80mPa.S, add 0.0200g of vinyl rings, and mix evenly Obtain component B and pack it for use;

[0033] Wherein the vinyl silicone oil is a mixture of 95g terminal vinyl silicone oil and 5g side chain vinyl silicone oil. When in use, mix the prepared component A and component B uniformly at a weight ratio of 95:100, cure at room temperature for 8 hours, and cure at 80°C for 30 minutes.

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Abstract

The invention relates to silicone gel and specifically provides a high adhesiveness silicone gel for embedding a precision electron component. The silicone gel comprises a component A and a component B that have similar viscosity and are in transparent fluid shape. The component A mainly comprises vinyl silicone oil and catalyst; the component B mainly comprises vinyl silicone oil, cross-linking agent and inhibitor; an accessory employs a diluent or an adhesion agent or a mixture of the two; the accessory is arranged in the component A or the component B or both of the two; and the component A and the component B are independently packaged and mixed in a ratio of 1:0.8-1.2 for usage. The invention has advantages of good fluidity, property of automatic deaeration and simple operation. The component A and the component B are independently packaged, and the two components will not gelatinize after mixing, so as to gain a long operating time; the mixture can solidify rapidly once heated, and the solidification time can be controlled freely by temperature and inhibitor amount; and the silicone gel is in semi-solidification state after solidification, has good adhesiveness and sealing performance on many base materials and has excellent hot-cold alternate resistance.

Description

Technical field: [0001] The invention relates to silicone gel, in particular to a high-adhesive silicone gel for potting precision electronic components. Background technique: [0002] Silicone gel has the general characteristics of addition-type liquid silicone rubber, such as high and low temperature resistance, electrical insulation, no by-products during vulcanization, small shrinkage, non-toxic, odorless, non-corrosive, and safe to use. Low cross-linking density, and endow it with good shock absorption, adhesion, sealing, moisture resistance and anti-fouling properties, so it is an ideal potting material for precision electronic components. However, in the process of use, silicone gel has the problem of unsatisfactory adhesion to many substrates. In order to improve this deficiency, the patent [Japanese Patent Laid-Open No. 62-290754] discloses the use of additive hexamethyldisilica Azane, the patent [Japanese Patent Application No. 63-165455] discloses the use of sily...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/04C08L83/06C09J183/07C09J183/05C09J183/04C09J183/06C09K3/10
Inventor 张建敏李允浩赵洁李献起胡质云李全昶李索海陈春江
Owner TANGSHAN SANYOU SILICON IND
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