The invention belongs to the technical field of circuit boards and discloses a high-thermal-
conductivity metal-based double-sided
copper-based
copper-clad plate. The high-thermal-
conductivity metal-based double-sided
copper-based copper-clad plate comprises a
metal copper plate, protective film
layers, heat conduction
layers and
copper foil layers; the metal copper plate is arranged in the middle;the
copper foil layers are fixedly mounted at the top and bottom of the metal copper plate; and the heat conduction layers are fixedly mounted at the top and bottom of the
copper foil layers. According to the high-thermal-
conductivity metal-based double-sided copper-based copper-clad plate and the preparation process thereof of the invention, a heat conduction
adhesive is additionally adopted, and the heat conduction
adhesive has excellent cold and hot alternating resistance,
aging resistance and electric insulation performance; the heat conduction layers are adopted, and the heat conductionlayers have small
thermal resistance, excellent viscoelastic properties and
thermal aging resistance and can bear mechanical and thermal stress; since the heat conduction
adhesive and the heat conduction layers are adopted, the
thermal conductivity of the metal-based double-sided copper-based copper-clad plate can be greatly improved, the heat of an electronic device can be dissipated quickly whenthe metal-based double-sided copper-clad plate is used together with the electronic device; and therefore, the popularization of the metal-based double-sided copper-based copper-clad plate is benefited.