High-heat-dissipation multilayer copper substrate and manufacturing method therefor

A manufacturing process and technology of copper substrates, which are applied in circuit substrate materials, printed circuit manufacturing, circuit thermal devices, etc., can solve the problem of inconvenient disassembly of copper substrates, and achieve improved light utilization, high thermal stability, and high thermal conductivity. strong effect

Pending Publication Date: 2019-02-26
广东合通建业科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a high heat dissipation multilayer coppe...

Method used

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  • High-heat-dissipation multilayer copper substrate and manufacturing method therefor
  • High-heat-dissipation multilayer copper substrate and manufacturing method therefor
  • High-heat-dissipation multilayer copper substrate and manufacturing method therefor

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Embodiment Construction

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-3 , the present invention provides a technical solution: a high heat dissipation multilayer copper substrate and its manufacturing process, including a circuit layer (1), an ink layer (3) and a cooling tube (22), the outer surface of the circuit layer (1) is set There is a waterproof layer (27), the outer surface of the waterproof layer (27) is provided with wiring holes (23), the bottom of the wiring holes (23) is provided with screw holes ...

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Abstract

The invention discloses a high-heat-dissipation multilayer copper substrate and a manufacturing process therefor, and the substrate comprises a circuit layer, an ink layer and a refrigeration tube. The outer surface of the circuit layer is provided with a waterproof layer, and a screw hole is arranged below a wiring hole. A through hole is fixedly installed at one side of a screw, and a pressure plate is disposed under a carbon-based composite fiber layer. A resin coating substrate is disposed under a thermal interface layer, and a copper coating plate is disposed under the resin coating substrate. A metal core substrate is disposed under a non-woven substrate, and a shielding plate is disposed under a polyester film. A substrate is disposed under a silicone film, and a buffer layer is disposed under a thermal adhesive layer. A heat dissipation tail is disposed under the copper substrate, and the refrigeration tube and the heat dissipation tail are fixedly connected. According to the invention, the substrate provided by the invention is provided with the refrigeration tube, a bright silver plating layer and the screw, which enhances the cooling effect, improves the utilization ratio of the light, and solves the problem that an existing copper substrate is not convenient for disassembly.

Description

technical field [0001] The invention relates to the technical field of copper substrates, in particular to a multilayer copper substrate with high heat dissipation and a manufacturing process thereof. Background technique [0002] Copper substrate is the most expensive kind of metal substrate, and its heat conduction effect is many times better than that of aluminum substrate and iron substrate. Immersion gold copper substrate, silver-plated copper substrate, tin-sprayed copper substrate, anti-oxidation copper substrate, etc. [0003] Copper substrate The copper substrate circuit layer requires a large current-carrying capacity, so thicker copper foil should be used. The heat-conducting insulating layer is the core technology of the copper substrate. The core heat-conducting component is composed of aluminum oxide and silicon powder and ring Oxygen resin filled polymer composition, small thermal resistance, excellent viscoelastic properties, thermal aging resistance, and ca...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/05H05K3/00
CPCH05K1/021H05K1/0206H05K1/0207H05K1/05H05K3/00H05K2201/064
Inventor 陈子安李浩光文军
Owner 广东合通建业科技股份有限公司
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