High-heat-dissipation multilayer copper substrate and manufacturing method therefor
A manufacturing process and technology of copper substrates, which are applied in circuit substrate materials, printed circuit manufacturing, circuit thermal devices, etc., can solve the problem of inconvenient disassembly of copper substrates, and achieve improved light utilization, high thermal stability, and high thermal conductivity. strong effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0030] see Figure 1-3 , the present invention provides a technical solution: a high heat dissipation multilayer copper substrate and its manufacturing process, including a circuit layer (1), an ink layer (3) and a cooling tube (22), the outer surface of the circuit layer (1) is set There is a waterproof layer (27), the outer surface of the waterproof layer (27) is provided with wiring holes (23), the bottom of the wiring holes (23) is provided with screw holes ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com