High-thermal-conductivity metal-based double-sided copper-based copper-clad plate and preparation process thereof

Abstract

The invention belongs to the technical field of circuit boards and discloses a high-thermal-conductivity metal-based double-sided copper-based copper-clad plate. The high-thermal-conductivity metal-based double-sided copper-based copper-clad plate comprises a metal copper plate, protective film layers, heat conduction layers and copper foil layers; the metal copper plate is arranged in the middle;the copper foil layers are fixedly mounted at the top and bottom of the metal copper plate; and the heat conduction layers are fixedly mounted at the top and bottom of the copper foil layers. According to the high-thermal-conductivity metal-based double-sided copper-based copper-clad plate and the preparation process thereof of the invention, a heat conduction adhesive is additionally adopted, and the heat conduction adhesive has excellent cold and hot alternating resistance, aging resistance and electric insulation performance; the heat conduction layers are adopted, and the heat conductionlayers have small thermal resistance, excellent viscoelastic properties and thermal aging resistance and can bear mechanical and thermal stress; since the heat conduction adhesive and the heat conduction layers are adopted, the thermal conductivity of the metal-based double-sided copper-based copper-clad plate can be greatly improved, the heat of an electronic device can be dissipated quickly whenthe metal-based double-sided copper-clad plate is used together with the electronic device; and therefore, the popularization of the metal-based double-sided copper-based copper-clad plate is benefited.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a metal-based double-sided copper-based copper-clad laminate with high thermal conductivity and a preparation process thereof. Background technique [0002] The full name of copper clad laminate is copper clad laminate. It is made of wood pulp paper or glass fiber cloth as a reinforcing material, soaked in resin, covered with copper foil on one or both sides, and hot pressed. Copper clad laminate is the basic material of the electronics industry. It is mainly used for processing and manufacturing printed circuit boards (PCB). It is composed of three parts and a conductive layer (generally copper foil), that is, one or both sides of the metal substrate with the surface treated are covered with insulating medium and copper foil, and are compounded by hot pressing. [0003] With the rapid development of the electronics industry, the size of electronic products is getting small...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a metal-based double-sided copper-based copper-clad laminate with high thermal conductivity and its preparation process, which has the advantages of good thermal conductivity and good oxidation resistance, and solves the problem of existing metal-based double-sided copper-based copper clad laminates. The thermal conductivity of the base copper-clad laminate is not outstanding, and the heat of the power device cannot be dissipated in time, which greatly limits the promotion and use of the metal-based double-sided copper-based copper-clad laminate. At the same time, the metal-based double-sided copper-based copper-clad laminate is easy to oxidize, reducing the The service life of double-sided copper-based copper-clad laminates increases the cost of using metal-based double-sided copper-based copper-clad laminates, further restricting its popularization and use, and the consumption is far lower than that of aluminum-based copper-clad laminates.