Silicon piezoresistive pressure sensor core body and production method thereof
A pressure sensor and sensor chip technology, applied in the field of sensors, can solve the problems of inappropriate design of ceramic seat, large thickness of silicone rubber bonding, and inability to produce small ranges, etc., and achieve the effect of light weight, good linear characteristics, and low price
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Embodiment 1
[0062] Example 1: CYX19-10G pressure sensor core
[0063] CYX19-10G pressure sensor core dimensions, unit: mm:
[0064] Outer diameter: φ19 0 -0.05 ;
[0065] Height: 15±0.1;
[0066] Pin spacing: 2.54±0.10;
[0067] Adhesive chip cavity size 4.6±0.1×4.2±0.1;
[0068] Bondable cavity size (φ7.8±0.1)×(0.4±0.05);
[0069] Oil injection chamber height: 1.2mm;
[0070] The diameter of the elastic deformation surface of the corrugated diaphragm is φ18mm
[0071] A. Cleaning:
[0072] Key material: core seat
[0073] The pressure sensor oil injection core seat is made of 316L stainless steel, the lead wire is made of 4J29 or 4J34 iron-cobalt-nickel alloy, the gold plating layer on the surface of the lead wire is more than 99.7% electroplated gold, and only cobalt is used as the hardener. The gold plating process is on the electroplated nickel layer or It is carried out on the electroless nickel plating layer, the thickness of the gold plating layer is ≥0.3μm, and the ...
Embodiment 2
[0133] Example 2: CYX19-5G pressure sensor core
[0134] CYX19-5G pressure sensor core dimensions, unit: mm:
[0135] Outer diameter: φ19 0 -0.05 ;
[0136] Height: 15±0.1;
[0137] Pin spacing: 2.54±0.10;
[0138] Adhesive chip cavity size (4.6±0.1)×(4.2±0.1);
[0139] Bondable cavity size (φ7.8±0.1)×(0.4±0.05);
[0140] Oil injection cavity height: 0.8;
[0141] The diameter of the elastic deformation surface of the corrugated diaphragm is φ18.
[0142] (1) Die bonding
[0143] The cavity size of CYX19-5G core seat bonding area is (4.6mm±0.1mm)×(4.2mm±0.1mm), and the cavity depth is 0.8mm±0.1 mm. The chip height is 1.3mm. The chip size of the pressure sensor is relatively thick, and the problem of insufficient height is solved by using a method of dimples at the sticking position of the core seat.
[0144] The thickness of the chip is 1300μm, which is used as a benchmark for theoretical analysis. The depth of CYX19-5G core seat cavity is 800μm±100μm, and the ...
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