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Rosin-based flux for soldering and solder paste

A rosin and flux technology, applied in rosin coatings, welding/cutting media/materials, welding media, etc., can solve the problems of complicated manufacturing process, contamination of the surface of the mounting substrate, and large generation, and achieves good visibility and color tone. excellent effect

Active Publication Date: 2012-07-04
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since these are thermoplastic materials, the solder paste may slump when heated at a high temperature during soldering.
Especially in the case where the solder powder is composed of lead-free solder alloy, heat slump is prone to occur due to soldering at high temperature
As a result, a large number of tiny solder balls are generated around the electrodes, or bridging occurs between electrodes, and sometimes a short circuit occurs
[0003] In addition, rosin contains various low-boiling components. Therefore, flux components are scattered from the solder paste during soldering and adhere to the surroundings of the electrode terminals. As a result, the surface of the mounting substrate is polluted or insulation failure occurs.
Therefore, a flux recovery device may be assembled in a reflow furnace, or a mounting board may be cleaned, but this complicates the manufacturing process and increases the cost.
[0004] As a method for preventing heat slump, there is known a flux in which a hydrogenated alcohol-modified dicyclopentadiene-based resin is used as a base resin instead of rosin (Japanese Patent Application Laid-Open No. 2009-154170 ), but the effect is not sufficient.
In addition, a flux using distilled rosin whose content of low-boiling point components is adjusted to less than 7% by weight as a rosin base resin has been proposed for flux spattering (Japanese Patent Application Laid-Open No. 2008-62241 ), but the solder paste is easily heated. Slumps, has a tendency to produce a large number of solder balls

Method used

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  • Rosin-based flux for soldering and solder paste
  • Rosin-based flux for soldering and solder paste
  • Rosin-based flux for soldering and solder paste

Examples

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Embodiment

[0055] Hereinafter, although an Example and a comparative example are given and this invention is demonstrated more concretely, this invention is not limited to these Examples.

[0056] In addition, in each preparation example, "melt viscosity" represents the value obtained by a commercially available B8M type viscometer (product name "VISCOMETER", manufactured by TOKIMEC Co., Ltd., Robot No. HM-1), "Content of maleopimaric acid anhydrides" and "content of low molecular weight components" indicate a commercially available gel permeation chromatography measuring device (product name "High Speed ​​GPC System HLC-8220", manufactured by Tosoh Corporation, column name " TSK-GEL G1000HXL", manufactured by Tosoh Corporation, developing agent tetrahydrofuran), and "Content of dehydroabietic acid" indicates values ​​obtained from a commercially available gas chromatograph (product name "GC7890", manufactured by Agilent Corporation) The calculated value of .

[0057]

preparation example 1

[0059] Step (1): Refining

[0060] Unrefined gum rosin (measured acid value 171mgKOH / g, unit carboxyl molar concentration 3.2×10 -3 mol / g, softening temperature 74°C, Gardner chroma 6, made in China) was added to a vacuum distillation vessel, and distilled under a reduced pressure of 0.4kPa under a nitrogen seal to obtain refined rosin (actually measured acid value 177, softened Temperature 80°C, Gardner color 3).

[0061] Step (2): Diels-Alder reaction

[0062] Next, 700 g of the purified rosin and 154 g of maleic anhydride were added to another vacuum distillation vessel, and reacted at 220° C. for 4 hours while stirring with a nitrogen stream, and then, the unreacted rosin was removed under a reduced pressure of 4 kPa. As a result, rosin derivatives (theoretical acid value 144mgKOH / g, unit carboxyl molar concentration 2.7×10 -3 mol / g, softening temperature 121°C, Gardner color 8).

[0063] Step (3): Hydrogenation reaction

[0064] Next, 500 g of the rosin derivative an...

preparation example 2

[0068] A hydrogenated rosin derivative (A-2) (hereinafter referred to as (A-2) component) was obtained in the same manner except that 154 g of maleic anhydride in the step (2) of Production Example 1 was changed to 77 g. Table 1 shows physical properties and the like.

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Abstract

This invention is to provide a rosin-based flux used for soldering, which virtually does not cause scattering during soldering and can inhibit heat slump of the solder paste. This invention adopts the rosin derivative hydride (A) as a base material, which contains maleo pimaric acid anhydride (a-1) represented by the following structure formula (I) and has a melt viscosity of 100 to 1000 mPa.S / 180 DEG C.

Description

technical field [0001] The present invention relates to a rosin-based flux and a solder paste for soldering. Background technique [0002] Solder paste is sometimes used when soldering electronic components such as ICs, capacitors, and resistors to electrodes on printed circuit boards. The solder paste contains solder powder and a flux composition, and as the flux composition, a composition based on rosin and its derivatives is generally used. However, since these are thermoplastic raw materials, the solder paste may slump when heated at a high temperature during soldering. In particular, when the solder powder is made of a lead-free solder alloy, since soldering is performed at a high temperature, thermal slumping tends to occur. As a result, a large number of tiny solder balls are generated around the electrodes, or bridging occurs between the electrodes, and a circuit short circuit sometimes occurs. [0003] In addition, rosins contain various low-boiling components. T...

Claims

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Application Information

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IPC IPC(8): B23K35/362B23K35/24
CPCB23K35/36C07D209/58C09D193/04
Inventor 吉本哲也中谷隆
Owner ARAKAWA CHEM IND LTD
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