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Anisotropic conductive film, composition contained therein and device having the film

An anisotropic, conductive film technology for conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, film/flake adhesives, etc.

Active Publication Date: 2015-01-14
KUKDO ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since conventional curing systems for anisotropic conductive films do not contain specific components that prevent shrinkage during curing, there are limitations in improving the reliability of anisotropic conductive films

Method used

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  • Anisotropic conductive film, composition contained therein and device having the film
  • Anisotropic conductive film, composition contained therein and device having the film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Embodiment 1: Preparation of anisotropic conductive film composition

[0072]Prepare an adhesive resin system, which consists of 3wt% polyurethane microbeads (MM-101-MS, sample prepared from Negami, Tg: 15°C) with a particle size of 0.1 μm in toluene / methyl ethyl ketone, 32wt% Polyurethane resin (UN5500, Negami), 5wt% of acrylonitrile-butadiene rubber (NBR) resin (N-34, Nippon Zeon) (30vol%) and 24wt% of MMA, BA and cyclohexyl methacrylate Alkyl methacrylate resin (weight average molecular weight = 90,000 g / mol, acid value = 2KOHmg / mg) composition of the copolymer. The binder resin system serves as a film-forming matrix. Prepare a curing system consisting of 25 wt% urethane acrylate (UN5507, Negami), 1 wt% 2-methacryloyloxyethyl phosphate as a reactive monomer, 2 wt% pentaerythritol tri(methyl) Acrylate and 2.5% by weight of 2-hydroxyethyl (meth)acrylate. Curing takes place in this curing system. Mix the adhesive resin system, the curing system, 2.5 wt% lauroyl pero...

Embodiment 2

[0073] Embodiment 2: Preparation of anisotropic conductive film composition

[0074] A film composition was prepared in the same manner as in Example 1, except that 21 wt % and 6 wt % of acrylic resin and polyurethane microbeads were used, respectively.

Embodiment 3-4

[0075] Example 3-4: Preparation of anisotropic conductive film composition

[0076] A film composition was prepared in the same manner as in Example 1 except that the size of the polyurethane microbeads was changed as shown in Table 1. In Example 3, polyurethane microbeads (particle diameter=0.8 μm, Tg: 40° C.) were used. In Example 4, polyurethane microbeads (particle diameter=1.0 μm, Tg: 40° C.) were used.

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Abstract

The invention discloses an anisotropic conductive film, a composition contained therein and a device having the film. The anisotropic conductive film comprises polyurethane beads. The anisotropic conductive film has high bonding strength and good reliability and no problem of compatibility. The invention further discloses a composition contained in the anisotropic conductive film and a device having the anisotropic conductive film.

Description

technical field [0001] The present invention relates to an anisotropic conductive film, a composition contained in the anisotropic conductive film, and a device including the anisotropic conductive film. More specifically, the present invention relates to an anisotropic conductive film comprising polyurethane microbeads to achieve high adhesive strength and good reliability without causing compatibility problems, a composition contained in the anisotropic conductive film and a composition comprising each Anisotropic Conductive Film Devices. Background technique [0002] The anisotropic conductive film refers to a film-like adhesive in which conductive particles such as metal particles (eg, nickel or gold particles) or metal-coated polymer particles are dispersed. When an anisotropic conductive film is inserted between circuits to be connected, followed by heat and pressure under specific conditions, the circuit terminals are electrically connected through conductive particl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/00C09J9/02C09J175/16C09J11/08
CPCC08J5/18C08L75/04C09J7/22C09J2203/00C09J2301/312C09J2301/314C09J2301/408H01B1/20
Inventor 裵相植鱼东善申炅勋曹长铉金镇圭高连助黃慈英朴憬修尹康培朴镇晟
Owner KUKDO ADVANCED MATERIALS CO LTD