Rectangular plane cathode arc evaporation source of combination magnetic fields

Abstract

The invention discloses a rectangular plane cathode arc evaporation source of combination magnetic fields, which comprises a rectangular target material flat plate. A middle shaft permanent magnet, four end corner permanent magnets and at least two long circular electromagnetic coils are arranged right below the target material flat plate at the position a certain distance away from the target material flat plate. The electromagnetic coils are parallelly arranged along the edge of the target material flat plate in annular sleeving mode and are connected with an adjustable direct current power supply through wires, the four end corner permanent magnets are respectively arranged at the positions of four end corners, wherein the middle shaft permanent magnet is arranged on the inner side of the electromagnetic coil on the innermost side along the long axial direction, the magnetic fields formed by the middle shaft permanent magnet, the end corner permanent magnets and the electromagnetic coils have the same polarity. The rectangular plane cathode arc evaporation source of combination magnetic fields can achieve high utilization rate of a target material and form fine and smooth film layers no matter magnetizing current is changed or not.

Description

technical field [0001] The invention relates to a vacuum cathodic arc deposition technology for ion plating, in particular to the magnetic field structure design of a large-area rectangular planar cathodic arc source. Background technique [0002] Cathodic arc deposition is one of the mainstream technologies of ion plating hard film at present. Because of its high plasma concentration, high ionization rate, large particle energy, fast deposition speed, good film-base bonding force and good film quality, it has been widely used. Application; its disadvantage is that the film layer has macroscopic (large) particles of plating material, and the surface is rough. Cathodic arc deposition is the use of cathodic arc evaporation source to evaporate the target material to generate plasma deposition and film formation. The principle is to use vacuum arc discharge to generate fine arc arc spots on the target surface, and the arc spots are emitted through the high temperature---field ef...

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Problems solved by technology

[0002] Cathodic arc deposition is one of the mainstream technologies for ion plating hard film at present. Because of its high plasma concentration, high ionization rate, large particle energy, fast deposition speed, good film-base bonding force, and good film quality, it has been widely used. Application; the disadvantage is that the film layer has macroscopic (large) particles of coating materials, and the surface is rough

[0007] Generally speaking, the traditional permanent magnet or electromagnetic coil structure design is limited by the shape and arrangement of the magnet or coil components, and it is difficult to obtain the shape of the magnetic force line with a flat arched hole with a wide drop channel, especially in the central area of ​​the target surface , the surrounding edge area, and the four-sided corner area are not in the magnetic field line tunnel, and the arc spot rarely enters these areas, so the target utilization rate is low, generally only about 20-25%

Because the moving area of ​​the arc spot is not large enough, the heat on the target surface is relatively concentrated, the temperature rise of the target surface is relatively high, the splashed liquid droplets are larger and more, and the film layer is rough

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