Flexible ultrasonic glue dipping device

Abstract

The invention discloses a flexible ultrasonic glue dipping device. The flexible ultrasonic glue dipping device comprises a tank body, wherein the tank body is provided with an inner concave chamber for containing liquid resin, is of a two-layer structure and comprises an inner tank body and an outer tank body; a space for storing cycling medium is formed between the inner tank body and the outer tank body; the outer tank body is respectively provided with a liquid inlet and a liquid outlet which are respectively communicated with the space; and the outer wall of the outer tank body is provided with a flexible ultrasonic device with adjustable parameters such as frequency and power. The flexible ultrasonic glue dipping device disclosed by the invention has the advantages that ultrasonic waves produced by the ultrasonic device act on fiber and the liquid resin uniformly by means of the cycling medium to realize glue dipping, and after the glue dipping procedure is finished, when a glue dipping tank is cleaned, the ultrasonic waves also act on sewage in the tank body, therefore, for the glue dipping and cleaning processes, a physical means is adopted in the flexible ultrasonic glue dipping device, and on the basis of realizing glue dipping, the cleaning effect is improved, the cleaning process is simplified, and the influence on the reuse effect of the glue dipping tank is avoided.

Description

technical field [0001] The invention relates to a composite material processing equipment, in particular to a flexible ultrasonic dipping device suitable for molding processes of fiber-reinforced polymer-based composite materials (such as carbon fiber composite core conductor mandrels) such as filament winding and pultrusion. Background technique [0002] Carbon fiber composite core wire is a new type of energy-saving wire that has appeared in recent years. Its weight is about 20% lighter than that of steel-reinforced aluminum stranded wire of the same specification, and its thermal expansion coefficient is less than 2×10 -6 1 / °C, the sag is less than 1 / 10 of the conventional ACSR at high temperature, the tensile strength is greater than 2100MPa, the operating temperature can reach 180°C, and the cross-sectional area of ​​the aluminum material at the same diameter is that of the conventional ACSR 1.29 times, the theoretical carrying capacity is 2 times that of the ACSR, and ...

AI Technical Summary

Problems solved by technology

[0004] In the existing filament winding, pultrusion and other carbon fiber reinforced polymer matrix composite material molding processes, due to the high viscosity of the resin and the low ambient temperature, the wettability of the carbon fiber in the resin is poor and the glue content is not ideal. Defects that often cause the performance of the formed carbon fiber mandrel to decrease

Moreover, the traditional dipping tank is extremely difficult to clean after use, and the remaining resin and dropped fibers will adhere to the inner wall of the dipping tank. If the dipping tank is not cleaned cleanly, it will adversely affect the next production

[0005] At present, the method of improving the wettability of fibers is mainly to heat the resin or reduce the viscosity of the resin, but this method has the following defects: (1) when the heating method is adopted, it needs to be heated to a higher temperature for some resin systems, and Excessively high temperature will affect the performance of the resin glue and shorten the storage time; (2) To reduce the viscosity of the resin, it is usually necessary to add a diluent to the resin. The addition of a diluent will often affect the performance of the resin, and it is necessary to increase the subsequent baking Bake the diluent process, thus leading to the complexity of the process

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