DMP-30 (dimethyl phthalate-30) closing method and application of DMP-30 in epoxy adhesive

A DMP-30, weight percentage technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of short operation time, too fast gel, etc., and achieve the effect of easy operation performance

Inactive Publication Date: 2012-07-25
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by this invention is to provide a kind of sealing method of DMP-30, is to control the pH value of the whole system by adding acidic substance in DMP-30 to guarantee that DMP-30 keeps latent property to a certain extent, overcomes easy and The epoxy group undergoes a ring-opening reaction in a short period of time, resulting in the defects of short operating time and too fast gel during use

Method used

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  • DMP-30 (dimethyl phthalate-30) closing method and application of DMP-30 in epoxy adhesive
  • DMP-30 (dimethyl phthalate-30) closing method and application of DMP-30 in epoxy adhesive
  • DMP-30 (dimethyl phthalate-30) closing method and application of DMP-30 in epoxy adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Accurately weigh each raw material according to the following weight percentages, the amount of DMP-30 is 90%, and phosphorous acid is 10%. Through the simple physical mixing of the two, after mixing evenly, the pH value of the formed mixture is 7.1, and the mixture is kept at room temperature for use. Its application in epoxy adhesive consists of the following raw materials: 30% of 828EL epoxy resin, 2% of tert-butyl carbonate glycidyl ether diluent, 30% of Nanjing Huayuan silicon powder NF110, sealed DMP- 30 38%. Put the above components into the double planetary power mixing mixer in turn, evacuate until the vacuum degree is -0.08 ~ -0.05MPa, stir at 500 rpm for 2 hours, and stir evenly.

Embodiment 2

[0027] Accurately weigh each raw material according to the following weight percentages, the amount of DMP-30 is 80%, and the amount of citric acid is 20%. Through the simple physical mixing of the two, after mixing evenly, the pH value of the formed mixture is 9.8, and the mixture is kept at room temperature for use. Its application in epoxy adhesive consists of the following raw materials: E51 epoxy resin 25%, H8 diluent 5%, 600 mesh silica powder filler 54%, KH560 coupling agent 1%, sealed DMP-30 15 %. Put the above components into the double planetary power mixing mixer in turn, evacuate until the vacuum degree is -0.08 ~ -0.05MPa, stir at 500 rpm for 2 hours, and stir evenly.

Embodiment 3

[0029] Accurately weigh each raw material according to the following percentages by weight, the amount of DMP-30 is 60%, and the amount of oleic acid is 40%. Through the simple physical mixing of the two, after mixing evenly, the pH value of the formed mixture is 8.3, and the mixture is kept at room temperature for use. Its application in epoxy adhesives consists of the following raw materials: 8240 epoxy resin 44%, 1,4 butanediol glycidyl ether diluent 1%, 600 mesh silica powder filler 29%, KH560 coupling agent 1% , DMP-30 after sealing 25%. Put the above components into the double planetary power mixing mixer in turn, evacuate until the vacuum degree is -0.08~-0.05MPa, stir at 500 rpm for 2 hours, and stir evenly.

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Abstract

The invention relates to a DMP-30 (dimethyl phthalate-30) closing method, which includes mixing, by weight, 60%-90% of DMP-30 and 10-40% of acidoid to disable the DMP-30 to open loops of epoxy perssad. The balance can be damaged by gently heating to start curing reaction in practical application of the DMP-30, so that the DMP-30 turns to be similar to a latency curing agent or curing catalyst. The invention further comprises epoxy adhesive containing the closed DMP-30, and the adhesive can be used for adhering only by gently heating.

Description

technical field [0001] The invention relates to a sealing method of DMP-30 and its application in epoxy adhesives, which are used to improve the stability of the DMP-30 in epoxy adhesives, belonging to the field of epoxy resin adhesives. Background technique [0002] The structural formula of DMP-30 is: [0003] [0004] Its molecular formula: C15H27N3O, molecular weight: 265.40, CAS No.: 90-72-2, name: 2,4,6-tris(dimethylaminomethyl)phenol, English name: 2,4,6-tris(dimethylaminomethyl )phenol flash point: 150°C; specific gravity (25°C): 0.97, appearance is light yellow transparent liquid, boiling point is about 250°C, has amine odor, easily soluble in organic solvents, soluble in cold water, slightly soluble in hot water. [0005] DMP-30 is mainly used as an epoxy resin curing agent, which can be used for fast curing or low temperature curing epoxy resin coating at room temperature, and is used for castings, seals, etc. DMP-30 can be used alone as an epoxy resin curing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C09J163/00
Inventor 骆万兴王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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